diff options
| author | Daniel Vetter <daniel.vetter@ffwll.ch> | 2017-07-26 13:23:10 +0200 |
|---|---|---|
| committer | Daniel Vetter <daniel.vetter@ffwll.ch> | 2017-07-26 13:43:33 +0200 |
| commit | af055598542670c8533a58582813b1419949cae0 (patch) | |
| tree | 901fa1bf635d5c1e91d08f9f4c2e4943516dbb71 /Documentation/devicetree/bindings/vendor-prefixes.txt | |
| parent | drm/syncobj: Fix kerneldoc (diff) | |
| parent | Merge tag 'drm-intel-next-2017-07-17' of git://anongit.freedesktop.org/git/dr... (diff) | |
| download | linux-af055598542670c8533a58582813b1419949cae0.tar.xz linux-af055598542670c8533a58582813b1419949cae0.zip | |
Merge airlied/drm-next into drm-misc-next
I need this to be able to apply the deferred fbdev setup patches, I
need the relevant prep work that landed through the drm-intel tree.
Also squash in conflict fixup from Laurent Pinchart.
Signed-off-by: Daniel Vetter <daniel.vetter@ffwll.ch>
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.txt')
| -rw-r--r-- | Documentation/devicetree/bindings/vendor-prefixes.txt | 12 |
1 files changed, 12 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt index 834554fc15c0..36b27b1efec6 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.txt +++ b/Documentation/devicetree/bindings/vendor-prefixes.txt @@ -5,6 +5,7 @@ using them to avoid name-space collisions. abcn Abracon Corporation abilis Abilis Systems +actions Actions Semiconductor Co., Ltd. active-semi Active-Semi International Inc ad Avionic Design GmbH adapteva Adapteva, Inc. @@ -28,6 +29,7 @@ andestech Andes Technology Corporation apm Applied Micro Circuits Corporation (APM) aptina Aptina Imaging arasan Arasan Chip Systems +arctic Arctic Sand aries Aries Embedded GmbH arm ARM Ltd. armadeus ARMadeus Systems SARL @@ -44,6 +46,7 @@ avia avia semiconductor avic Shanghai AVIC Optoelectronics Co., Ltd. axentia Axentia Technologies AB axis Axis Communications AB +bananapi BIPAI KEJI LIMITED boe BOE Technology Group Co., Ltd. bosch Bosch Sensortec GmbH boundary Boundary Devices Inc. @@ -158,6 +161,8 @@ iom Iomega Corporation isee ISEE 2007 S.L. isil Intersil issi Integrated Silicon Solutions Inc. +itead ITEAD Intelligent Systems Co.Ltd +iwave iWave Systems Technologies Pvt. Ltd. jdi Japan Display Inc. jedec JEDEC Solid State Technology Association karo Ka-Ro electronics GmbH @@ -165,6 +170,7 @@ keithkoep Keith & Koep GmbH keymile Keymile GmbH khadas Khadas kinetic Kinetic Technologies +kingnovel Kingnovel Technology Co., Ltd. kosagi Sutajio Ko-Usagi PTE Ltd. kyo Kyocera Corporation lacie LaCie @@ -172,8 +178,10 @@ lantiq Lantiq Semiconductor lego LEGO Systems A/S lenovo Lenovo Group Ltd. lg LG Corporation +libretech Shenzhen Libre Technology Co., Ltd licheepi Lichee Pi linaro Linaro Limited +linksys Belkin International, Inc. (Linksys) linux Linux-specific binding lltc Linear Technology Corporation lsi LSI Corp. (LSI Logic) @@ -268,8 +276,10 @@ renesas Renesas Electronics Corporation richtek Richtek Technology Corporation ricoh Ricoh Co. Ltd. rikomagic Rikomagic Tech Corp. Ltd +riscv RISC-V Foundation rockchip Fuzhou Rockchip Electronics Co., Ltd rohm ROHM Semiconductor Co., Ltd +roofull Shenzhen Roofull Technology Co, Ltd samsung Samsung Semiconductor samtec Samtec/Softing company sandisk Sandisk Corporation @@ -333,6 +343,7 @@ tronfy Tronfy tronsmart Tronsmart truly Truly Semiconductors Limited tyan Tyan Computer Corporation +ucrobotics uCRobotics udoo Udoo uniwest United Western Technologies Corp (UniWest) upisemi uPI Semiconductor Corp. @@ -358,6 +369,7 @@ xlnx Xilinx xunlong Shenzhen Xunlong Software CO.,Limited zarlink Zarlink Semiconductor zeitec ZEITEC Semiconductor Co., LTD. +zidoo Shenzhen Zidoo Technology Co., Ltd. zii Zodiac Inflight Innovations zte ZTE Corp. zyxel ZyXEL Communications Corp. |