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authorLinus Torvalds <torvalds@linux-foundation.org>2017-07-07 19:37:54 +0200
committerLinus Torvalds <torvalds@linux-foundation.org>2017-07-07 19:37:54 +0200
commitdd6ec12f3bf83ca3c4e712a9f35960aec779f6f9 (patch)
tree8b6f9f187eb0ae621a64798270c420143c698484 /Documentation/devicetree/bindings/vendor-prefixes.txt
parentMerge branch 'mailbox-for-next' of git://git.linaro.org/landing-teams/working... (diff)
parentMerge branch 'dt/property-move' into dt/next (diff)
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Merge tag 'devicetree-for-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull DeviceTree updates from Rob Herring: - vsprintf format specifier %pOF for device_node's. This will enable us to stop storing the full node names. Conversion of users will happen next cycle. - Update documentation to point to DT specification instead of ePAPR. - Split out graph and property functions to a separate file. - New of-graph functions for ALSA - Add vendor prefixes for RISC-V, Linksys, iWave Systems, Roofull, Itead, and BananaPi. - Improve dtx_diff utility filename printing. * tag 'devicetree-for-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (32 commits) of: document /sys/firmware/fdt dt-bindings: Add RISC-V vendor prefix vsprintf: Add %p extension "%pOF" for device tree of: find_node_by_full_name rewrite to compare each level of: use kbasename instead of open coding dt-bindings: thermal: add file extension to brcm,ns-thermal of: update ePAPR references to point to Devicetree Specification scripts/dtc: dtx_diff - Show real file names in diff header of: detect invalid phandle in overlay of: be consistent in form of file mode of: make __of_attach_node() static of: address.c header comment typo of: fdt.c header comment typo of: make of_fdt_is_compatible() static dt-bindings: display-timing.txt convert non-ascii characters to ascii Documentation: remove overlay-notes reference to non-existent file dt-bindings: usb: exynos-usb: Add missing required VDD properties dt-bindings: Add vendor prefix for Linksys MAINTAINERS: add device tree ABI documentation file of: Add vendor prefix for iWave Systems Technologies Pvt. Ltd ...
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.txt')
-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.txt6
1 files changed, 6 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index 286f4e1e111f..708ff2504260 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -45,6 +45,7 @@ avia avia semiconductor
avic Shanghai AVIC Optoelectronics Co., Ltd.
axentia Axentia Technologies AB
axis Axis Communications AB
+bananapi BIPAI KEJI LIMITED
boe BOE Technology Group Co., Ltd.
bosch Bosch Sensortec GmbH
boundary Boundary Devices Inc.
@@ -159,6 +160,8 @@ iom Iomega Corporation
isee ISEE 2007 S.L.
isil Intersil
issi Integrated Silicon Solutions Inc.
+itead ITEAD Intelligent Systems Co.Ltd
+iwave iWave Systems Technologies Pvt. Ltd.
jdi Japan Display Inc.
jedec JEDEC Solid State Technology Association
karo Ka-Ro electronics GmbH
@@ -177,6 +180,7 @@ lg LG Corporation
libretech Shenzhen Libre Technology Co., Ltd
licheepi Lichee Pi
linaro Linaro Limited
+linksys Belkin International, Inc. (Linksys)
linux Linux-specific binding
lltc Linear Technology Corporation
lsi LSI Corp. (LSI Logic)
@@ -269,8 +273,10 @@ renesas Renesas Electronics Corporation
richtek Richtek Technology Corporation
ricoh Ricoh Co. Ltd.
rikomagic Rikomagic Tech Corp. Ltd
+riscv RISC-V Foundation
rockchip Fuzhou Rockchip Electronics Co., Ltd
rohm ROHM Semiconductor Co., Ltd
+roofull Shenzhen Roofull Technology Co, Ltd
samsung Samsung Semiconductor
samtec Samtec/Softing company
sandisk Sandisk Corporation