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authorLinus Torvalds <torvalds@linux-foundation.org>2014-01-25 02:27:34 +0100
committerLinus Torvalds <torvalds@linux-foundation.org>2014-01-25 02:27:34 +0100
commit4d8880a0ee5b3cdf7927c6cf59a164f352e4f436 (patch)
treeb11c4af3b283f4850da11f4be856b7a432375720 /Documentation/devicetree/bindings/vendor-prefixes.txt
parentMerge tag 'rdma-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/r... (diff)
parentdt-bindings: add rockchip vendor prefix (diff)
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Merge tag 'devicetree-for-3.14' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring: - Add new documents with guidelines for DT binding stability and review process. This is one of the outcomes of Kernel Summit DT discussions - Remove a bunch of device_type usage which is only for OF and deprecated with FDT - Fix a long standing issue with compatible string match ordering - Various minor binding documentation updates * tag 'devicetree-for-3.14' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: dt-bindings: add rockchip vendor prefix serial: vt8500: Add missing binding document for arch-vt8500 serial driver. dt/bindings: submitting patches and ABI documents DT: Add vendor prefix for Emerging Display Technologies of: add vendor prefixe for EPFL of: add vendor prefix for Gumstix of: add vendor prefix for Ka-Ro electronics GmbH devicetree: macb: Document clock properties dts: bindings: trivial clock bindings doc fixes of: Fix __of_device_is_available check dt/bindings: Remove device_type "serial" from marvell,mv64360-mpsc dt/bindings: remove device_type "network" references dt/bindings: remove users of device_type "mdio" dt/bindings: Remove references to linux,phandle properties dt/bindings: Remove all references to device_type "ethernet-phy" of: irq: Ignore disabled intc's when searching map of: irq: Ignore disabled interrupt controllers OF: base: match each node compatible against all given matches first dt-bindings: add GIC-400 binding
Diffstat (limited to 'Documentation/devicetree/bindings/vendor-prefixes.txt')
-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.txt5
1 files changed, 5 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index 520596da7953..5780ffcd79af 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -27,13 +27,16 @@ cortina Cortina Systems, Inc.
dallas Maxim Integrated Products (formerly Dallas Semiconductor)
davicom DAVICOM Semiconductor, Inc.
denx Denx Software Engineering
+edt Emerging Display Technologies
emmicro EM Microelectronic
+epfl Ecole Polytechnique Fédérale de Lausanne
epson Seiko Epson Corp.
est ESTeem Wireless Modems
fsl Freescale Semiconductor
GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
gmt Global Mixed-mode Technology, Inc.
+gumstix Gumstix, Inc.
haoyu Haoyu Microelectronic Co. Ltd.
hisilicon Hisilicon Limited.
hp Hewlett Packard
@@ -42,6 +45,7 @@ idt Integrated Device Technologies, Inc.
img Imagination Technologies Ltd.
intercontrol Inter Control Group
isl Intersil
+karo Ka-Ro electronics GmbH
lg LG Corporation
linux Linux-specific binding
lsi LSI Corp. (LSI Logic)
@@ -64,6 +68,7 @@ ralink Mediatek/Ralink Technology Corp.
ramtron Ramtron International
realtek Realtek Semiconductor Corp.
renesas Renesas Electronics Corporation
+rockchip Fuzhou Rockchip Electronics Co., Ltd
samsung Samsung Semiconductor
sbs Smart Battery System
schindler Schindler