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authorLinus Torvalds <torvalds@linux-foundation.org>2020-06-12 23:10:21 +0200
committerLinus Torvalds <torvalds@linux-foundation.org>2020-06-12 23:10:21 +0200
commitdf2fbf5bfa0e7fff8b4784507e4d68f200454318 (patch)
tree1c61918031bf2c7fab9e17dde3c52a6a9884fcb5 /Documentation/devicetree
parentMerge branch 'proc-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/eb... (diff)
parentthermal/int340x_thermal: Don't require IDSP to exist (diff)
downloadlinux-df2fbf5bfa0e7fff8b4784507e4d68f200454318.tar.xz
linux-df2fbf5bfa0e7fff8b4784507e4d68f200454318.zip
Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano: - Add the hwmon support on the i.MX SC (Anson Huang) - Thermal framework cleanups (self-encapsulation, pointless stubs, private structures) (Daniel Lezcano) - Use the PM QoS frequency changes for the devfreq cooling device (Matthias Kaehlcke) - Remove duplicate error messages from platform_get_irq() error handling (Markus Elfring) - Add support for the bandgap sensors (Keerthy) - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz) - Add Renesas R-Car maintainer entry (Niklas Söderlund) - Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC thermal (Sudip Mukherjee) - Add latency constraint for the idle injection, the DT binding and the change the registering function (Daniel Lezcano) - Convert the thermal framework binding to the Yaml schema (Amit Kucheria) - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva) - Thermal framework cleanups (alphabetic order for heads, replace module.h by export.h, make file naming consistent) (Amit Kucheria) - Merge tsens-common into the tsens driver (Amit Kucheria) - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven) - Clean up the rcar_thermal_update_temp() function in the rcar thermal driver (Niklas Söderlund) - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang) - Export GDDV, OEM vendor variables, and don't require IDSP for the int340x thermal driver - trivial conflicts fixed (Matthew Garrett) * tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits) thermal/int340x_thermal: Don't require IDSP to exist thermal/int340x_thermal: Export OEM vendor variables thermal/int340x_thermal: Export GDDV thermal: qoriq: Update the settings for TMUv2 thermal: rcar_thermal: Clean up rcar_thermal_update_temp() thermal: qoriq: Add platform dependencies drivers: thermal: tsens: Merge tsens-common.c into tsens.c thermal/of: Rename of-thermal.c thermal/governors: Prefix all source files with gov_ thermal/drivers/user_space: Sort headers alphabetically thermal/drivers/of-thermal: Sort headers alphabetically thermal/drivers/cpufreq_cooling: Replace module.h with export.h thermal/drivers/cpufreq_cooling: Sort headers alphabetically thermal/drivers/clock_cooling: Include export.h thermal/drivers/clock_cooling: Sort headers alphabetically thermal/drivers/thermal_hwmon: Include export.h thermal/drivers/thermal_hwmon: Sort headers alphabetically thermal/drivers/thermal_helpers: Include export.h thermal/drivers/thermal_helpers: Sort headers alphabetically thermal/core: Replace module.h with export.h ...
Diffstat (limited to 'Documentation/devicetree')
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml116
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-idle.yaml145
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-sensor.yaml72
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-zones.yaml341
-rw-r--r--Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml56
5 files changed, 730 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
new file mode 100644
index 000000000000..5145883d932e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -0,0 +1,116 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal cooling device binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of cooling devices and thermal zones required to
+ take appropriate action to mitigate thermal overload.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the cooling devices.
+
+ There are essentially two ways to provide control on power dissipation:
+ - Passive cooling: by means of regulating device performance. A typical
+ passive cooling mechanism is a CPU that has dynamic voltage and frequency
+ scaling (DVFS), and uses lower frequencies as cooling states.
+ - Active cooling: by means of activating devices in order to remove the
+ dissipated heat, e.g. regulating fan speeds.
+
+ Any cooling device has a range of cooling states (i.e. different levels of
+ heat dissipation). They also have a way to determine the state of cooling in
+ which the device is. For example, a fan's cooling states correspond to the
+ different fan speeds possible. Cooling states are referred to by single
+ unsigned integers, where larger numbers mean greater heat dissipation. The
+ precise set of cooling states associated with a device should be defined in
+ a particular device's binding.
+
+select: true
+
+properties:
+ "#cooling-cells":
+ description:
+ Must be 2, in order to specify minimum and maximum cooling state used in
+ the cooling-maps reference. The first cell is the minimum cooling state
+ and the second cell is the maximum cooling state requested.
+ const: 2
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example 1: Cpufreq cooling device on CPU0
+ cpus {
+ #address-cells = <2>;
+ #size-cells = <0>;
+
+ CPU0: cpu@0 {
+ device_type = "cpu";
+ compatible = "qcom,kryo385";
+ reg = <0x0 0x0>;
+ enable-method = "psci";
+ cpu-idle-states = <&LITTLE_CPU_SLEEP_0
+ &LITTLE_CPU_SLEEP_1
+ &CLUSTER_SLEEP_0>;
+ capacity-dmips-mhz = <607>;
+ dynamic-power-coefficient = <100>;
+ qcom,freq-domain = <&cpufreq_hw 0>;
+ #cooling-cells = <2>;
+ next-level-cache = <&L2_0>;
+ L2_0: l2-cache {
+ compatible = "cache";
+ next-level-cache = <&L3_0>;
+ L3_0: l3-cache {
+ compatible = "cache";
+ };
+ };
+ };
+
+ /* ... */
+
+ };
+
+ /* ... */
+
+ thermal-zones {
+ cpu0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 1>;
+
+ trips {
+ cpu0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu0_alert0>;
+ /* Corresponds to 1000MHz in OPP table */
+ cooling-device = <&CPU0 5 5>;
+ };
+ };
+ };
+
+ /* ... */
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
new file mode 100644
index 000000000000..7a922f540934
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml
@@ -0,0 +1,145 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal idle cooling device binding
+
+maintainers:
+ - Daniel Lezcano <daniel.lezcano@linaro.org>
+
+description: |
+ The thermal idle cooling device allows the system to passively
+ mitigate the temperature on the device by injecting idle cycles,
+ forcing it to cool down.
+
+ This binding describes the thermal idle node.
+
+properties:
+ $nodename:
+ const: thermal-idle
+ description: |
+ A thermal-idle node describes the idle cooling device properties to
+ cool down efficiently the attached thermal zone.
+
+ '#cooling-cells':
+ const: 2
+ description: |
+ Must be 2, in order to specify minimum and maximum cooling state used in
+ the cooling-maps reference. The first cell is the minimum cooling state
+ and the second cell is the maximum cooling state requested.
+
+ duration-us:
+ description: |
+ The idle duration in microsecond the device should cool down.
+
+ exit-latency-us:
+ description: |
+ The exit latency constraint in microsecond for the injected
+ idle state for the device. It is the latency constraint to
+ apply when selecting an idle state from among all the present
+ ones.
+
+required:
+ - '#cooling-cells'
+
+examples:
+ - |
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example: Combining idle cooling device on big CPUs with cpufreq cooling device
+ cpus {
+ #address-cells = <2>;
+ #size-cells = <0>;
+
+ /* ... */
+
+ cpu_b0: cpu@100 {
+ device_type = "cpu";
+ compatible = "arm,cortex-a72";
+ reg = <0x0 0x100>;
+ enable-method = "psci";
+ capacity-dmips-mhz = <1024>;
+ dynamic-power-coefficient = <436>;
+ #cooling-cells = <2>; /* min followed by max */
+ cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
+ };
+
+ cpu_b1: cpu@101 {
+ device_type = "cpu";
+ compatible = "arm,cortex-a72";
+ reg = <0x0 0x101>;
+ enable-method = "psci";
+ capacity-dmips-mhz = <1024>;
+ dynamic-power-coefficient = <436>;
+ #cooling-cells = <2>; /* min followed by max */
+ cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
+ };
+
+ /* ... */
+
+ };
+
+ /* ... */
+
+ thermal_zones {
+ cpu_thermal: cpu {
+ polling-delay-passive = <100>;
+ polling-delay = <1000>;
+
+ /* ... */
+
+ trips {
+ cpu_alert0: cpu_alert0 {
+ temperature = <65000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_alert1: cpu_alert1 {
+ temperature = <70000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_alert2: cpu_alert2 {
+ temperature = <75000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_crit: cpu_crit {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu_alert1>;
+ cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >,
+ <&{/cpus/cpu@101/thermal-idle} 0 15>;
+ };
+
+ map1 {
+ trip = <&cpu_alert2>;
+ cooling-device =
+ <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+ };
diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
new file mode 100644
index 000000000000..fcd25a0af38c
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
@@ -0,0 +1,72 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal sensor binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of thermal zones required to take appropriate
+ action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-sensor.
+
+ Thermal sensor devices provide temperature sensing capabilities on thermal
+ zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
+ devices may control one or more internal sensors.
+
+properties:
+ "#thermal-sensor-cells":
+ description:
+ Used to uniquely identify a thermal sensor instance within an IC. Will be
+ 0 on sensor nodes with only a single sensor and at least 1 on nodes
+ containing several internal sensors.
+ enum: [0, 1]
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+ // Example 1: SDM845 TSENS
+ soc: soc@0 {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@c265000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
new file mode 100644
index 000000000000..b8515d3eeaa2
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -0,0 +1,341 @@
+# SPDX-License-Identifier: (GPL-2.0)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
+$schema: http://devicetree.org/meta-schemas/base.yaml#
+
+title: Thermal zone binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of cooling devices and thermal zones required to
+ take appropriate action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or actively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-zones.
+
+ The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
+ (temperature derivative over time) in two situations for a thermal zone:
+ 1. when passive cooling is activated (polling-delay-passive)
+ 2. when the zone just needs to be monitored (polling-delay) or when
+ active cooling is activated.
+
+ The maximum dT/dt is highly bound to hardware power consumption and
+ dissipation capability. The delays should be chosen to account for said
+ max dT/dt, such that a device does not cross several trip boundaries
+ unexpectedly between polls. Choosing the right polling delays shall avoid
+ having the device in temperature ranges that may damage the silicon structures
+ and reduce silicon lifetime.
+
+properties:
+ $nodename:
+ const: thermal-zones
+ description:
+ A /thermal-zones node is required in order to use the thermal framework to
+ manage input from the various thermal zones in the system in order to
+ mitigate thermal overload conditions. It does not represent a real device
+ in the system, but acts as a container to link a thermal sensor device,
+ platform-data regarding temperature thresholds and the mitigation actions
+ to take when the temperature crosses those thresholds.
+
+patternProperties:
+ "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
+ type: object
+ description:
+ Each thermal zone node contains information about how frequently it
+ must be checked, the sensor responsible for reporting temperature for
+ this zone, one sub-node containing the various trip points for this
+ zone and one sub-node containing all the zone cooling-maps.
+
+ properties:
+ polling-delay:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone. Setting this to 0 disables the polling
+ timers setup by the thermal framework and assumes that the thermal
+ sensors in this zone support interrupts.
+
+ polling-delay-passive:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone while doing passive cooling. Setting
+ this to 0 disables the polling timers setup by the thermal
+ framework and assumes that the thermal sensors in this zone
+ support interrupts.
+
+ thermal-sensors:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ maxItems: 1
+ description:
+ The thermal sensor phandle and sensor specifier used to monitor this
+ thermal zone.
+
+ coefficients:
+ $ref: /schemas/types.yaml#/definitions/uint32-array
+ description:
+ An array of integers containing the coefficients of a linear equation
+ that binds all the sensors listed in this thermal zone.
+
+ The linear equation used is as follows,
+ z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
+ where c0, c1, .., cn are the coefficients.
+
+ Coefficients default to 1 in case this property is not specified. The
+ coefficients are ordered and are matched with sensors by means of the
+ sensor ID. Additional coefficients are interpreted as constant offset.
+
+ sustainable-power:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ An estimate of the sustainable power (in mW) that this thermal zone
+ can dissipate at the desired control temperature. For reference, the
+ sustainable power of a 4-inch phone is typically 2000mW, while on a
+ 10-inch tablet is around 4500mW.
+
+ trips:
+ type: object
+ description:
+ This node describes a set of points in the temperature domain at
+ which the thermal framework needs to take action. The actions to
+ be taken are defined in another node called cooling-maps.
+
+ patternProperties:
+ "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
+ type: object
+
+ properties:
+ temperature:
+ $ref: /schemas/types.yaml#/definitions/int32
+ minimum: -273000
+ maximum: 200000
+ description:
+ An integer expressing the trip temperature in millicelsius.
+
+ hysteresis:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ An unsigned integer expressing the hysteresis delta with
+ respect to the trip temperature property above, also in
+ millicelsius. Any cooling action initiated by the framework is
+ maintained until the temperature falls below
+ (trip temperature - hysteresis). This potentially prevents a
+ situation where the trip gets constantly triggered soon after
+ cooling action is removed.
+
+ type:
+ $ref: /schemas/types.yaml#/definitions/string
+ enum:
+ - active # enable active cooling e.g. fans
+ - passive # enable passive cooling e.g. throttling cpu
+ - hot # send notification to driver
+ - critical # send notification to driver, trigger shutdown
+ description: |
+ There are four valid trip types: active, passive, hot,
+ critical.
+
+ The critical trip type is used to set the maximum
+ temperature threshold above which the HW becomes
+ unstable and underlying firmware might even trigger a
+ reboot. Hitting the critical threshold triggers a system
+ shutdown.
+
+ The hot trip type can be used to send a notification to
+ the thermal driver (if a .notify callback is registered).
+ The action to be taken is left to the driver.
+
+ The passive trip type can be used to slow down HW e.g. run
+ the CPU, GPU, bus at a lower frequency.
+
+ The active trip type can be used to control other HW to
+ help in cooling e.g. fans can be sped up or slowed down
+
+ required:
+ - temperature
+ - hysteresis
+ - type
+ additionalProperties: false
+
+ additionalProperties: false
+
+ cooling-maps:
+ type: object
+ description:
+ This node describes the action to be taken when a thermal zone
+ crosses one of the temperature thresholds described in the trips
+ node. The action takes the form of a mapping relation between a
+ trip and the target cooling device state.
+
+ patternProperties:
+ "^map[-a-zA-Z0-9]*$":
+ type: object
+
+ properties:
+ trip:
+ $ref: /schemas/types.yaml#/definitions/phandle
+ description:
+ A phandle of a trip point node within this thermal zone.
+
+ cooling-device:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ description:
+ A list of cooling device phandles along with the minimum
+ and maximum cooling state specifiers for each cooling
+ device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
+ cooling-device phandle limit specifier lets the framework
+ use the minimum and maximum cooling state for that cooling
+ device automatically.
+
+ contribution:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ minimum: 0
+ maximum: 100
+ description:
+ The percentage contribution of the cooling devices at the
+ specific trip temperature referenced in this map
+ to this thermal zone
+
+ required:
+ - trip
+ - cooling-device
+ additionalProperties: false
+
+ required:
+ - polling-delay
+ - polling-delay-passive
+ - thermal-sensors
+ - trips
+ additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example 1: SDM845 TSENS
+ soc: soc@0 {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@c265000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
+ <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow", "critical";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+
+ /* ... */
+
+ thermal-zones {
+ cpu0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 1>;
+
+ trips {
+ cpu0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_alert1: trip-point1 {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_crit: cpu_crit {
+ temperature = <110000>;
+ hysteresis = <1000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu0_alert0>;
+ /* Corresponds to 1400MHz in OPP table */
+ cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
+ <&CPU2 3 3>, <&CPU3 3 3>;
+ };
+
+ map1 {
+ trip = <&cpu0_alert1>;
+ /* Corresponds to 1000MHz in OPP table */
+ cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
+ <&CPU2 5 5>, <&CPU3 5 5>;
+ };
+ };
+ };
+
+ /* ... */
+
+ cluster0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 5>;
+
+ trips {
+ cluster0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ cluster0_crit: cluster0_crit {
+ temperature = <110000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+ };
+
+ /* ... */
+
+ gpu-top-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 11>;
+
+ trips {
+ gpu1_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ };
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
new file mode 100644
index 000000000000..25b9209c2e5d
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
@@ -0,0 +1,56 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Texas Instruments AM654 VTM (DTS) binding
+
+maintainers:
+ - Keerthy <j-keerthy@ti.com>
+
+properties:
+ compatible:
+ const: ti,am654-vtm
+
+ reg:
+ maxItems: 1
+
+ power-domains:
+ maxItems: 1
+
+ "#thermal-sensor-cells":
+ const: 1
+
+required:
+ - compatible
+ - reg
+ - power-domains
+ - "#thermal-sensor-cells"
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/soc/ti,sci_pm_domain.h>
+ vtm: thermal@42050000 {
+ compatible = "ti,am654-vtm";
+ reg = <0x0 0x42050000 0x0 0x25c>;
+ power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
+ #thermal-sensor-cells = <1>;
+ };
+
+ mpu0_thermal: mpu0_thermal {
+ polling-delay-passive = <250>; /* milliseconds */
+ polling-delay = <500>; /* milliseconds */
+ thermal-sensors = <&vtm0 0>;
+
+ trips {
+ mpu0_crit: mpu0_crit {
+ temperature = <125000>; /* milliCelsius */
+ hysteresis = <2000>; /* milliCelsius */
+ type = "critical";
+ };
+ };
+ };
+...