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| author | Len Brown <len.brown@intel.com> | 2019-05-13 19:59:00 +0200 |
|---|---|---|
| committer | Thomas Gleixner <tglx@linutronix.de> | 2019-05-23 10:08:36 +0200 |
| commit | b2ce1c883df91a231f8138935167273c1767ad66 (patch) | |
| tree | 558b6e49c32c90592911559f1001b80cc1657066 /Documentation/spi/spidev | |
| parent | perf/x86/intel/cstate: Support multi-die/package (diff) | |
| download | linux-b2ce1c883df91a231f8138935167273c1767ad66.tar.xz linux-b2ce1c883df91a231f8138935167273c1767ad66.zip | |
thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
Syntax update only -- no logical or functional change.
In response to the new multi-die/package changes, update variable names to
use the more generic thermal "zone" terminology, instead of "package", as
the zones can refer to either packages or die.
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com
Diffstat (limited to 'Documentation/spi/spidev')
0 files changed, 0 insertions, 0 deletions