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author | Amit Kucheria <amit.kucheria@linaro.org> | 2020-04-03 09:01:46 +0200 |
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committer | Daniel Lezcano <daniel.lezcano@linaro.org> | 2020-05-22 17:57:43 +0200 |
commit | c1bba2c94decdec382c6a07d9ba722cefd617575 (patch) | |
tree | c39569bc9cb1e0a210580050567a2a7de3aa921e /Documentation | |
parent | thermal: cpuidle: Register cpuidle cooling device (diff) | |
download | linux-c1bba2c94decdec382c6a07d9ba722cefd617575.tar.xz linux-c1bba2c94decdec382c6a07d9ba722cefd617575.zip |
dt-bindings: thermal: Add yaml bindings for thermal sensors
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org
Diffstat (limited to 'Documentation')
-rw-r--r-- | Documentation/devicetree/bindings/thermal/thermal-sensor.yaml | 72 |
1 files changed, 72 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000000..fcd25a0af38c --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,72 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; +... |