diff options
author | Andrew Lunn <andrew@lunn.ch> | 2014-03-22 13:45:56 +0100 |
---|---|---|
committer | Rob Herring <robh@kernel.org> | 2014-04-14 19:26:06 +0200 |
commit | 552481aace37a3698a2389bba04ae43fc969803b (patch) | |
tree | 7d3ff5f1047f2236be7b3d5039c2882514c00dec /Documentation | |
parent | DT: bindings: add missing Marvell Kirkwood SoC documentation (diff) | |
download | linux-552481aace37a3698a2389bba04ae43fc969803b.tar.xz linux-552481aace37a3698a2389bba04ae43fc969803b.zip |
DT: Vendor: Add prefixes used by Kirkwood devices
Add a number of vendor prefixes by kirkwood devices. These are not all
stock tickers, but have been in use for a while so changing would not
be easy.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Diffstat (limited to 'Documentation')
-rw-r--r-- | Documentation/devicetree/bindings/vendor-prefixes.txt | 13 |
1 files changed, 12 insertions, 1 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt index 5cfb6c102fcc..36b8530718db 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.txt +++ b/Documentation/devicetree/bindings/vendor-prefixes.txt @@ -22,6 +22,7 @@ auo AU Optronics Corporation avago Avago Technologies bosch Bosch Sensortec GmbH brcm Broadcom Corporation +buffalo Buffalo, Inc. calxeda Calxeda capella Capella Microsystems, Inc cavium Cavium, Inc. @@ -33,8 +34,8 @@ cortina Cortina Systems, Inc. crystalfontz Crystalfontz America, Inc. dallas Maxim Integrated Products (formerly Dallas Semiconductor) davicom DAVICOM Semiconductor, Inc. -dlink D-Link Systems, Inc. denx Denx Software Engineering +dlink D-Link Corporation dmo Data Modul AG edt Emerging Display Technologies emmicro EM Microelectronic @@ -42,6 +43,7 @@ epfl Ecole Polytechnique Fédérale de Lausanne epson Seiko Epson Corp. est ESTeem Wireless Modems eukrea Eukréa Electromatique +excito Excito fsl Freescale Semiconductor GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc. gef GE Fanuc Intelligent Platforms Embedded Systems, Inc. @@ -56,12 +58,14 @@ hp Hewlett Packard i2se I2SE GmbH ibm International Business Machines (IBM) idt Integrated Device Technologies, Inc. +iom Iomega Corporation img Imagination Technologies Ltd. intel Intel Corporation intercontrol Inter Control Group isee ISEE 2007 S.L. isl Intersil karo Ka-Ro electronics GmbH +keymile Keymile GmbH lacie LaCie lantiq Lantiq Semiconductor lg LG Corporation @@ -72,6 +76,8 @@ maxim Maxim Integrated Products microchip Microchip Technology Inc. mosaixtech Mosaix Technologies, Inc. moxa Moxa +mpl MPL AG +mxicy Macronix International Co., Ltd. national National Semiconductor neonode Neonode Inc. netgear NETGEAR @@ -85,10 +91,12 @@ opencores OpenCores.org panasonic Panasonic Corporation phytec PHYTEC Messtechnik GmbH picochip Picochip Ltd +plathome Plat'Home Co., Ltd. powervr PowerVR (deprecated, use img) qca Qualcomm Atheros, Inc. qcom Qualcomm Technologies, Inc qnap QNAP Systems, Inc. +raidsonic RaidSonic Technology GmbH ralink Mediatek/Ralink Technology Corp. ramtron Ramtron International realtek Realtek Semiconductor Corp. @@ -98,6 +106,7 @@ rockchip Fuzhou Rockchip Electronics Co., Ltd samsung Samsung Semiconductor sbs Smart Battery System schindler Schindler +seagate Seagate Technology PLC sil Silicon Image silabs Silicon Laboratories simtek @@ -114,6 +123,7 @@ ti Texas Instruments tlm Trusted Logic Mobility toshiba Toshiba Corporation toumaz Toumaz +usi Universal Scientifc Industrial Co., Ltd. v3 V3 Semiconductor via VIA Technologies, Inc. voipac Voipac Technologies s.r.o. @@ -122,3 +132,4 @@ wlf Wolfson Microelectronics wm Wondermedia Technologies, Inc. xes Extreme Engineering Solutions (X-ES) xlnx Xilinx +zyxel ZyXEL Communications Corp. |