Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
 "There are not too many changes this time, except two new platform
  thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
  driver, and a couple of small fixes.

  Highlights:

   - move the ti-soc-thermal driver out of the staging tree to the
     thermal tree.

   - introduce the x86_pkg_temp_thermal driver.  This driver registers
     CPU digital temperature package level sensor as a thermal zone.

   - small fixes/cleanups including removing redundant use of
     platform_set_drvdata() and of_match_ptr for all platform thermal
     drivers"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: cpu_cooling: fix stub function
  thermal: ti-soc-thermal: use standard GPIO DT bindings
  thermal: MAINTAINERS: Add git tree path for SoC specific updates
  thermal: fix x86_pkg_temp_thermal.c build and Kconfig
  Thermal: Documentation for x86 package temperature thermal driver
  Thermal: CPU Package temperature thermal
  thermal: consider emul_temperature while computing trend
  thermal: ti-soc-thermal: add DT example for DRA752 chip
  thermal: ti-soc-thermal: add dra752 chip to device table
  thermal: ti-soc-thermal: add thermal data for DRA752 chips
  thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
  thermal: ti-soc-thermal: freeze FSM while computing trend
  thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
  thermal: ti-soc-thermal: update DT reference for OMAP5430
  x86, mcheck, therm_throt: Process package thresholds
  thermal: cpu_cooling: fix 'descend' check in get_property()
  Thermal: spear: Remove redundant use of of_match_ptr
  Thermal: kirkwood: Remove redundant use of of_match_ptr
  Thermal: dove: Remove redundant use of of_match_ptr
  Thermal: armada: Remove redundant use of of_match_ptr
  ...

2 files changed, 121 insertions, 0 deletions

diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
new file mode 100644
index 000000000000..0c9222d27fae
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
@@ -0,0 +1,74 @@
+* Texas Instrument OMAP SCM bandgap bindings
+
+In the System Control Module, OMAP supplies a voltage reference
+and a temperature sensor feature that are gathered in the band
+gap voltage and temperature sensor (VBGAPTS) module. The band
+gap provides current and voltage reference for its internal
+circuits and other analog IP blocks. The analog-to-digital
+converter (ADC) produces an output value that is proportional
+to the silicon temperature.
+
+Required properties:
+- compatible : Should be:
+  - "ti,omap4430-bandgap" : for OMAP4430 bandgap
+  - "ti,omap4460-bandgap" : for OMAP4460 bandgap
+  - "ti,omap4470-bandgap" : for OMAP4470 bandgap
+  - "ti,omap5430-bandgap" : for OMAP5430 bandgap
+- interrupts : this entry should indicate which interrupt line
+the talert signal is routed to;
+Specific:
+- gpios : this entry should be used to inform which GPIO
+line the tshut signal is routed to. The informed GPIO will
+be treated as an IRQ;
+- regs : this entry must also be specified and it is specific
+to each bandgap version, because the mapping may change from
+soc to soc, apart of depending on available features.
+
+Example:
+OMAP4430:
+bandgap {
+	reg = <0x4a002260 0x4 0x4a00232C 0x4>;
+	compatible = "ti,omap4430-bandgap";
+};
+
+OMAP4460:
+bandgap {
+	reg = <0x4a002260 0x4
+		0x4a00232C 0x4
+		0x4a002378 0x18>;
+	compatible = "ti,omap4460-bandgap";
+	interrupts = <0 126 4>; /* talert */
+	gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP4470:
+bandgap {
+	reg = <0x4a002260 0x4
+		0x4a00232C 0x4
+		0x4a002378 0x18>;
+	compatible = "ti,omap4470-bandgap";
+	interrupts = <0 126 4>; /* talert */
+	gpios = <&gpio3 22 0>; /* tshut */
+};
+
+OMAP5430:
+bandgap {
+	reg = <0x4a0021e0 0xc
+		0x4a00232c 0xc
+		0x4a002380 0x2c
+		0x4a0023C0 0x3c>;
+	compatible = "ti,omap5430-bandgap";
+	interrupts = <0 126 4>; /* talert */
+};
+
+DRA752:
+bandgap {
+	reg = <0x4a0021e0 0xc
+		0x4a00232c 0xc
+		0x4a002380 0x2c
+		0x4a0023C0 0x3c
+		0x4a002564 0x8
+		0x4a002574 0x50>;
+	compatible = "ti,dra752-bandgap";
+	interrupts = <0 126 4>; /* talert */
+};
diff --git a/Documentation/thermal/x86_pkg_temperature_thermal b/Documentation/thermal/x86_pkg_temperature_thermal
new file mode 100644
index 000000000000..17a3a4c0a0ca
--- /dev/null
+++ b/Documentation/thermal/x86_pkg_temperature_thermal
@@ -0,0 +1,47 @@
+Kernel driver: x86_pkg_temp_thermal
+===================
+
+Supported chips:
+* x86: with package level thermal management
+(Verify using: CPUID.06H:EAX[bit 6] =1)
+
+Authors: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
+
+Reference
+---
+Intel® 64 and IA-32 Architectures Software Developer’s Manual (Jan, 2013):
+Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT
+
+Description
+---------
+
+This driver register CPU digital temperature package level sensor as a thermal
+zone with maximum two user mode configurable trip points. Number of trip points
+depends on the capability of the package. Once the trip point is violated,
+user mode can receive notification via thermal notification mechanism and can
+take any action to control temperature.
+
+
+Threshold management
+--------------------
+Each package will register as a thermal zone under /sys/class/thermal.
+Example:
+/sys/class/thermal/thermal_zone1
+
+This contains two trip points:
+- trip_point_0_temp
+- trip_point_1_temp
+
+User can set any temperature between 0 to TJ-Max temperature. Temperature units
+are in milli-degree Celsius. Refer to "Documentation/thermal/sysfs-api.txt" for
+thermal sys-fs details.
+
+Any value other than 0 in these trip points, can trigger thermal notifications.
+Setting 0, stops sending thermal notifications.
+
+Thermal notifications: To get kobject-uevent notifications, set the thermal zone
+policy to "user_space". For example: echo -n "user_space" > policy
+
+
+
+