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authorKan Liang <kan.liang@linux.intel.com>2019-05-13 19:59:03 +0200
committerThomas Gleixner <tglx@linutronix.de>2019-05-23 10:08:37 +0200
commiteb876fbc248e6eb4773a5bc80d205ff7262b1bb5 (patch)
treed7c4b3df872db0705b5b7f9e784eb31631154d89 /arch/x86/include/asm/smp.h
parentperf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support (diff)
downloadlinux-eb876fbc248e6eb4773a5bc80d205ff7262b1bb5.tar.xz
linux-eb876fbc248e6eb4773a5bc80d205ff7262b1bb5.zip
perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support
Syntax update only -- no logical or functional change. In response to the new multi-die/package changes, update variable names to use "die" terminology, instead of "pkg". For previous platforms which doesn't have multi-die, "die" is identical as "pkg". Signed-off-by: Kan Liang <kan.liang@linux.intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/0ddb97e121397d37933233da303556141814fa47.1557769318.git.len.brown@intel.com
Diffstat (limited to 'arch/x86/include/asm/smp.h')
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