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authorZhang Rui <rui.zhang@intel.com>2019-05-13 19:58:52 +0200
committerThomas Gleixner <tglx@linutronix.de>2019-05-23 10:08:33 +0200
commit724adec33c2491f26f739f285ddca25fca226e48 (patch)
treed0b5fc420a300532d0dd52661f2b75d28204de36 /drivers/block/loop.c
parentpowercap/intel_rapl: Support multi-die/package (diff)
downloadlinux-724adec33c2491f26f739f285ddca25fca226e48.tar.xz
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thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
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