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| author | Zhang Rui <rui.zhang@intel.com> | 2019-05-13 19:58:52 +0200 |
|---|---|---|
| committer | Thomas Gleixner <tglx@linutronix.de> | 2019-05-23 10:08:33 +0200 |
| commit | 724adec33c2491f26f739f285ddca25fca226e48 (patch) | |
| tree | d0b5fc420a300532d0dd52661f2b75d28204de36 /drivers/powercap | |
| parent | powercap/intel_rapl: Support multi-die/package (diff) | |
| download | linux-724adec33c2491f26f739f285ddca25fca226e48.tar.xz linux-724adec33c2491f26f739f285ddca25fca226e48.zip | |
thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
Diffstat (limited to 'drivers/powercap')
0 files changed, 0 insertions, 0 deletions