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| author | Zhang Rui <rui.zhang@intel.com> | 2019-05-13 19:58:53 +0200 |
|---|---|---|
| committer | Thomas Gleixner <tglx@linutronix.de> | 2019-05-23 10:08:33 +0200 |
| commit | 9ea7612c46586d9eacfd517e73ff76ef294feca0 (patch) | |
| tree | ce0f1d4d8f3d84d34bec1dc4c7b5e3e3639e2a99 /drivers/spi/spi-bcm-qspi.c | |
| parent | thermal/x86_pkg_temp_thermal: Support multi-die/package (diff) | |
| download | linux-9ea7612c46586d9eacfd517e73ff76ef294feca0.tar.xz linux-9ea7612c46586d9eacfd517e73ff76ef294feca0.zip | |
powercap/intel_rapl: Update RAPL domain name and debug messages
The RAPL domain "name" attribute contains "Package-N", which is ambiguous
on multi-die per-package systems.
Update the name to "package-X-die-Y" on those systems.
No change on systems without multi-die/package.
Update driver debug messages.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Link: https://lkml.kernel.org/r/6510b784e16374447965925588ec6e46d5d007d8.1557769318.git.len.brown@intel.com
Diffstat (limited to 'drivers/spi/spi-bcm-qspi.c')
0 files changed, 0 insertions, 0 deletions