diff options
| author | Zhang Rui <rui.zhang@intel.com> | 2019-05-13 19:58:52 +0200 |
|---|---|---|
| committer | Thomas Gleixner <tglx@linutronix.de> | 2019-05-23 10:08:33 +0200 |
| commit | 724adec33c2491f26f739f285ddca25fca226e48 (patch) | |
| tree | d0b5fc420a300532d0dd52661f2b75d28204de36 /drivers/thermal | |
| parent | powercap/intel_rapl: Support multi-die/package (diff) | |
| download | linux-724adec33c2491f26f739f285ddca25fca226e48.tar.xz linux-724adec33c2491f26f739f285ddca25fca226e48.zip | |
thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
Diffstat (limited to 'drivers/thermal')
| -rw-r--r-- | drivers/thermal/intel/x86_pkg_temp_thermal.c | 8 |
1 files changed, 4 insertions, 4 deletions
diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c index 1ef937d799e4..405b3858900a 100644 --- a/drivers/thermal/intel/x86_pkg_temp_thermal.c +++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c @@ -122,7 +122,7 @@ err_out: */ static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu) { - int pkgid = topology_logical_package_id(cpu); + int pkgid = topology_logical_die_id(cpu); if (pkgid >= 0 && pkgid < max_packages) return packages[pkgid]; @@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val) static int pkg_temp_thermal_device_add(unsigned int cpu) { - int pkgid = topology_logical_package_id(cpu); + int pkgid = topology_logical_die_id(cpu); u32 tj_max, eax, ebx, ecx, edx; struct pkg_device *pkgdev; int thres_count, err; @@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu) * worker will see the package anymore. */ if (lastcpu) { - packages[topology_logical_package_id(cpu)] = NULL; + packages[topology_logical_die_id(cpu)] = NULL; /* After this point nothing touches the MSR anymore. */ wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT, pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high); @@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void) if (!x86_match_cpu(pkg_temp_thermal_ids)) return -ENODEV; - max_packages = topology_max_packages(); + max_packages = topology_max_packages() * topology_max_die_per_package(); packages = kcalloc(max_packages, sizeof(struct pkg_device *), GFP_KERNEL); if (!packages) |