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| author | Tony Lindgren <tony@atomide.com> | 2014-12-01 20:10:15 +0100 |
|---|---|---|
| committer | Felipe Balbi <balbi@ti.com> | 2014-12-22 17:26:06 +0100 |
| commit | c0442479652b99b62dd1ffccb34231caff25751c (patch) | |
| tree | e4a8a19a52e698d8ee87322f43cf7e8561db1573 /ipc/syscall.c | |
| parent | usb: gadget: f_uac1: access freed memory at f_audio_free_inst (diff) | |
| download | linux-c0442479652b99b62dd1ffccb34231caff25751c.tar.xz linux-c0442479652b99b62dd1ffccb34231caff25751c.zip | |
usb: musb: Fix randconfig build issues for Kconfig options
Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
built in") enabled selecting multiple glue layers, which in turn
exposed things more for randconfig builds. If NOP_USB_XCEIV is
built-in and TUSB6010 is a loadable module, we will get:
drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
drivers/built-in.o: In function `tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1
Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").
And while at it, let's not allow selecting the glue layers except
on platforms really using them unless COMPILE_TEST is specified:
- TUSB6010 is in practise only used on omaps
- DSPS is only used on TI platforms
- UX500 is only used on STE platforms
Cc: Linus Walleij <linus.walleij@linaro.org>
Reported-by: Jim Davis <jim.epost@gmail.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'ipc/syscall.c')
0 files changed, 0 insertions, 0 deletions