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* Documentation: Use "while" instead of "whilst"Will Deacon2018-11-201-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | Whilst making an unrelated change to some Documentation, Linus sayeth: | Afaik, even in Britain, "whilst" is unusual and considered more | formal, and "while" is the common word. | | [...] | | Can we just admit that we work with computers, and we don't need to | use þe eald Englisc spelling of words that most of the world never | uses? dictionary.com refers to the word as "Chiefly British", which is probably an undesirable attribute for technical documentation. Replace all occurrences under Documentation/ with "while". Cc: David Howells <dhowells@redhat.com> Cc: Liam Girdwood <lgirdwood@gmail.com> Cc: Chris Wilson <chris@chris-wilson.co.uk> Cc: Michael Halcrow <mhalcrow@google.com> Cc: Jonathan Corbet <corbet@lwn.net> Reported-by: Linus Torvalds <torvalds@linux-foundation.org> Signed-off-by: Will Deacon <will.deacon@arm.com> Signed-off-by: Jonathan Corbet <corbet@lwn.net>
* thermal: Add cooling device's statistics in sysfsViresh Kumar2018-04-021-0/+31
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This extends the sysfs interface for thermal cooling devices and exposes some pretty useful statistics. These statistics have proven to be quite useful specially while doing benchmarks related to the task scheduler, where we want to make sure that nothing has disrupted the test, specially the cooling device which may have put constraints on the CPUs. The information exposed here tells us to what extent the CPUs were constrained by the thermal framework. The write-only "reset" file is used to reset the statistics. The read-only "time_in_state_ms" file shows the time (in msec) spent by the device in the respective cooling states, and it prints one line per cooling state. The read-only "total_trans" file shows single positive integer value showing the total number of cooling state transitions the device has gone through since the time the cooling device is registered or the time when statistics were reset last. The read-only "trans_table" file shows a two dimensional matrix, where an entry <i,j> (row i, column j) represents the number of transitions from State_i to State_j. This is how the directory structure looks like for a single cooling device: $ ls -R /sys/class/thermal/cooling_device0/ /sys/class/thermal/cooling_device0/: cur_state max_state power stats subsystem type uevent /sys/class/thermal/cooling_device0/power: autosuspend_delay_ms runtime_active_time runtime_suspended_time control runtime_status /sys/class/thermal/cooling_device0/stats: reset time_in_state_ms total_trans trans_table This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and ARM 64-bit Hisilicon hikey960 board running Android. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* cpu_cooling: Remove static-power related documentationViresh Kumar2018-01-031-80/+2
| | | | | | | | | | | commit 84fe2cab4859 ("cpu_cooling: Drop static-power related stuff") removed support for static-power in kernel, but it missed reflecting the same in documentation. Remove the static power related documentation bits as well. Reported-by: Javi Merino <javi.merino@kernel.org> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* cpu_cooling: Keep only one of_cpufreq*cooling_register() helperViresh Kumar2017-12-071-11/+3
| | | | | | | | | | | | | | | of_cpufreq_cooling_register() isn't used by anyone and so can be removed, but then we would be left with two routines: cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that would look odd. Remove current implementation of of_cpufreq_cooling_register() and rename of_cpufreq_power_cooling_register() as of_cpufreq_cooling_register(). This simplifies lots of stuff. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* cpu_cooling: Remove unused cpufreq_power_cooling_register()Viresh Kumar2017-12-071-21/+3
| | | | | | | | It isn't used by anyone, drop it. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* cpu_cooling: Make of_cpufreq_power_cooling_register() parse DTViresh Kumar2017-12-071-4/+3
| | | | | | | | | | | | All the callers of of_cpufreq_power_cooling_register() have almost identical code and it makes more sense to move that code into the helper as its all about reading DT properties. This got rid of lot of redundant code. Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* Merge branch 'next' of ↵Linus Torvalds2017-05-121-0/+21
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Fix a problem where orderly_shutdown() is called for multiple times due to multiple critical overheating events raised in a short period by platform thermal driver. (Keerthy) - Introduce a backup thermal shutdown mechanism, which invokes kernel_power_off()/emergency_restart() directly, after orderly_shutdown() being issued for certain amount of time(specified via Kconfig). This is useful in certain conditions that userspace may be unable to power off the system in a clean manner and leaves the system in a critical state, like in the middle of driver probing phase. (Keerthy) - Introduce a new interface in thermal devfreq_cooling code so that the driver can provide more precise data regarding actual power to the thermal governor every time the power budget is calculated. (Lukasz Luba) - Introduce BCM 2835 soc thermal driver and northstar thermal driver, within a new sub-folder. (Rafał Miłecki) - Introduce DA9062/61 thermal driver. (Steve Twiss) - Remove non-DT booting on TI-SoC driver. Also add support to fetching coefficients from DT. (Keerthy) - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund) - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien, Brian Bian) * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits) thermal: core: Add a back up thermal shutdown mechanism thermal: core: Allow orderly_poweroff to be called only once Thermal: Intel SoC DTS: Change interrupt request behavior trace: thermal: add another parameter 'power' to the tracing function thermal: devfreq_cooling: add new interface for direct power read thermal: devfreq_cooling: refactor code and add get_voltage function thermal: mt8173: minor mtk_thermal.c cleanups thermal: bcm2835: move to the broadcom subdirectory thermal: broadcom: ns: specify myself as MODULE_AUTHOR thermal: da9062/61: Thermal junction temperature monitoring driver Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding thermal: broadcom: add Northstar thermal driver dt-bindings: thermal: add support for Broadcom's Northstar thermal thermal: bcm2835: add thermal driver for bcm2835 SoC dt-bindings: Add thermal zone to bcm2835-thermal example thermal: rcar_gen3_thermal: add suspend and resume support thermal: rcar_gen3_thermal: store device match data in private structure thermal: rcar_gen3_thermal: enable hardware interrupts for trip points thermal: rcar_gen3_thermal: record and check number of TSCs found thermal: rcar_gen3_thermal: check that TSC exists before memory allocation ...
| * thermal: core: Add a back up thermal shutdown mechanismKeerthy2017-05-051-0/+21
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | orderly_poweroff is triggered when a graceful shutdown of system is desired. This may be used in many critical states of the kernel such as when subsystems detects conditions such as critical temperature conditions. However, in certain conditions in system boot up sequences like those in the middle of driver probes being initiated, userspace will be unable to power off the system in a clean manner and leaves the system in a critical state. In cases like these, the /sbin/poweroff will return success (having forked off to attempt powering off the system. However, the system overall will fail to completely poweroff (since other modules will be probed) and the system is still functional with no userspace (since that would have shut itself off). However, there is no clean way of detecting such failure of userspace powering off the system. In such scenarios, it is necessary for a backup workqueue to be able to force a shutdown of the system when orderly shutdown is not successful after a configurable time period. Reported-by: Nishanth Menon <nm@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Doc/PM: Sync with intel_powerclamp code behaviorJacob Pan2017-04-201-5/+15
|/ | | | | | | | | | | | Commit feb6cd6a0f9f ("thermal/intel_powerclamp: stop sched tick in forced idle") changed how idle injection accouting, so we need to update the documentation accordingly. This patch also expands more details on the behavior of cur_state. Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Reported-by: Wang, Xiaolong <xiaolong.wang@intel.com> Signed-off-by: Jonathan Corbet <corbet@lwn.net>
* Documentation: fix spelling mistakes of "Celcius" -- > "Celsius"Colin Ian King2017-01-041-1/+1
| | | | | | Signed-off-by: Colin Ian King <colin.king@canonical.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Jonathan Corbet <corbet@lwn.net>
* thermal: Add support for hardware-tracked trip pointsSascha Hauer2016-09-271-0/+7
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This adds support for hardware-tracked trip points to the device tree thermal sensor framework. The framework supports an arbitrary number of trip points. Whenever the current temperature is updated, the trip points immediately below and above the current temperature are found. A .set_trips callback is then called with the temperatures. If there is no trip point above or below the current temperature, the passed trip temperature will be -INT_MAX or INT_MAX respectively. In this callback, the driver should program the hardware such that it is notified when either of these trip points are triggered. When a trip point is triggered, the driver should call `thermal_zone_device_update' for the respective thermal zone. This will cause the trip points to be updated again. If .set_trips is not implemented, the framework behaves as before. This patch is based on an earlier version from Mikko Perttunen <mikko.perttunen@kapsi.fi> Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: export apis to get slope and offsetRajendra Nayak2016-09-271-0/+12
| | | | | | | | | Add apis for platform thermal drivers to query for slope and offset attributes, which might be needed for temperature calculations. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Doc: PM: Fix a typo in intel_powerclamp.txtMasanari Iida2016-06-301-1/+1
| | | | | | | This patch fix a spelling typo in intel_powerclamp.txt Signed-off-by: Masanari Iida <standby24x7@gmail.com> Signed-off-by: Jonathan Corbet <corbet@lwn.net>
* thermal: Syntactic and factual errors in the API documentAndy Champ2016-05-171-22/+22
| | | | | | | | | There are several places where the English in the document is syntactically invalid, or unclear. There are also one or two factual errors. Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Andy Champ <andycham@amazon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: doc: Add details of devm_thermal_zone_of_sensor_{register,unregister}Laxman Dewangan2016-03-091-0/+23
| | | | | | | | | Add details of the interface devm_thermal_zone_of_sensor_register() and devm_thermal_zone_of_sensor_unregister() in the <thermal/sysfs-api.txt>. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: doc: Add details of thermal_zone_of_sensor_{register,unregister}Laxman Dewangan2016-03-091-0/+45
| | | | | | | | | | | Add details of the interface thermal_zone_of_sensor_register() and thermal_zone_of_sensor_unregister() in the thermal/sysfs-api.txt. The details describes the functionality and parameter which are passed to these interfaces. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: add description for integral_cutoff unitLeo Yan2016-01-141-0/+1
| | | | | | | | | Add more explicitly description for unit of integral_cutoff which used by power allocator governor. Signed-off-by: Leo Yan <leo.yan@linaro.org> Acked-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Jonathan Corbet <corbet@lwn.net>
* thermal: power_allocator: relax the requirement of two passive trip pointsJavi Merino2015-09-141-1/+1
| | | | | | | | | | | | | | | The power allocator governor currently requires that the thermal zone has at least two passive trip points. If there aren't, the governor refuses to bind to the thermal zone. This commit relaxes that requirement. Now the governor will bind to all thermal zones regardless of how many trip points they have. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reviewed-by: Daniel Kurtz <djkurtz@chromium.org> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: add available policies sysfs attributeNi Wade2015-08-031-0/+6
| | | | | | | | | | | | | | The Linux thermal framework support to change thermal governor policy in userspace, but it can't show what available policies supported. This patch adds available_policies attribute to the thermal framework, it can list the thermal governors which can be used for a particular zone. This attribute is read only. Signed-off-by: Wei Ni <wni@nvidia.com> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: support slope and offset coefficientsEduardo Valentin2015-05-121-0/+16
| | | | | | | | | | | | | | | | | | | | It is common to have a linear extrapolation from the current sensor readings and the actual temperature value. This is specially the case when the sensor is in use to extrapolate hotspots. This patch adds slope and offset constants for single sensor linear extrapolation equation. Because the same sensor can be use in different locations, from board to board, these constants are added as part of thermal_zone_params. The constants are available through sysfs. It is up to the device driver to determine the usage of these values. Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: export thermal_zone_parameters to sysfsJavi Merino2015-05-051-0/+52
| | | | | | | | | | | It's useful for tuning to be able to edit thermal_zone_parameters from userspace. Export them to the thermal_zone sysfs so that they can be easily changed. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: introduce the Power Allocator governorJavi Merino2015-05-051-0/+247
| | | | | | | | | | | | | | | | | | | | | | | | | | The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: cpu_cooling: implement the power cooling device APIJavi Merino2015-05-051-1/+155
| | | | | | | | | | | | | | Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: fair_share: generalize the weight conceptJavi Merino2015-05-051-3/+9
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The fair share governor has the concept of weights, which is the influence of each cooling device in a thermal zone. The current implementation forces the weights of all cooling devices in a thermal zone to add up to a 100. This complicates setups, as you need to know in advance how many cooling devices you are going to have. If you bind a new cooling device, you have to modify all the other cooling devices weights, which is error prone. Furthermore, you can't specify a "default" weight for platforms since that default value depends on the number of cooling devices in the platform. This patch generalizes the concept of weight by allowing any number to be a "weight". Weights are now relative to each other. Platforms that don't specify weights get the same default value for all their cooling devices, so all their cdevs are considered to be equally influential. It's important to note that previous users of the weights don't need to alter the code: percentages continue to work as they used to. This patch just removes the constraint of all the weights in a thermal zone having to add up to a 100. If they do, you get the same behavior as before. If they don't, fair share now works for that platform. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: export weight to sysfsJavi Merino2015-05-051-1/+14
| | | | | | | | | | It's useful to have access to the weights for the cooling devices for thermal zones and change them if needed. Export them to sysfs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: of: fix cooling device weights in device treeKapileshwar Singh2015-05-051-1/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Documentation: thermal: document of_cpufreq_cooling_register()Javi Merino2015-01-061-2/+13
| | | | | | | | | | | | | | Commit 39d99cff76bf ("thermal: cpu_cooling: introduce of_cpufreq_cooling_register") taught the cpu cooling device to register devices that were linked to the device tree but didn't update the cpu-cooling-api documentation. Fix it. Cc: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Jonathan Corbet <corbet@lwn.net> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* drm/nouveau/doc: update the thermal documentationMartin Peres2014-06-171-3/+4
| | | | | | | | | | | Changes: - Change the maintainer's address (the labri address will expire soon); - Drop the note about not all families supporting all fan modes; - Add a note about the reported RPM not being accurate when driven outside the vbios-defined PWM range. Signed-off-by: Martin Peres <martin.peres@free.fr> Signed-off-by: Ben Skeggs <bskeggs@redhat.com>
* thermal: thermal_core: allow binding with limits on bind_paramsEduardo Valentin2013-09-031-0/+7
| | | | | | | | | | | | | | | | When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* drivers: thermal: make usage of CONFIG_THERMAL_HWMON optionalEduardo Valentin2013-09-031-0/+5
| | | | | | | | | | | | | | | | | | | | | | When registering a new thermal_device, the thermal framework will always add a hwmon sysfs interface. This patch adds a flag to make this behavior optional. Now when registering a new thermal device, the caller can optionally inform if hwmon interface is desirable. This can be done by means of passing a thermal_zone_params.no_hwmon == true. In order to keep same behavior as of today, all current calls will by default create the hwmon interface. Cc: David Woodhouse <dwmw2@infradead.org> Cc: linux-acpi@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: Zhang Rui <rui.zhang@intel.com> Suggested-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Documentation: thermal: Explain the exynos thermal driver modelAmit Daniel Kachhap2013-08-131-9/+34
| | | | | | | | | | | This patch updates the documentation to explain the driver model and file layout. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'next' of ↵Linus Torvalds2013-07-111-0/+47
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "There are not too many changes this time, except two new platform thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal driver, and a couple of small fixes. Highlights: - move the ti-soc-thermal driver out of the staging tree to the thermal tree. - introduce the x86_pkg_temp_thermal driver. This driver registers CPU digital temperature package level sensor as a thermal zone. - small fixes/cleanups including removing redundant use of platform_set_drvdata() and of_match_ptr for all platform thermal drivers" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: cpu_cooling: fix stub function thermal: ti-soc-thermal: use standard GPIO DT bindings thermal: MAINTAINERS: Add git tree path for SoC specific updates thermal: fix x86_pkg_temp_thermal.c build and Kconfig Thermal: Documentation for x86 package temperature thermal driver Thermal: CPU Package temperature thermal thermal: consider emul_temperature while computing trend thermal: ti-soc-thermal: add DT example for DRA752 chip thermal: ti-soc-thermal: add dra752 chip to device table thermal: ti-soc-thermal: add thermal data for DRA752 chips thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL thermal: ti-soc-thermal: freeze FSM while computing trend thermal: ti-soc-thermal: remove external heat while extrapolating hotspot thermal: ti-soc-thermal: update DT reference for OMAP5430 x86, mcheck, therm_throt: Process package thresholds thermal: cpu_cooling: fix 'descend' check in get_property() Thermal: spear: Remove redundant use of of_match_ptr Thermal: kirkwood: Remove redundant use of of_match_ptr Thermal: dove: Remove redundant use of of_match_ptr Thermal: armada: Remove redundant use of of_match_ptr ...
| * Thermal: Documentation for x86 package temperature thermal driverSrinivas Pandruvada2013-06-181-0/+47
| | | | | | | | | | | | | | | | Added documentation describing details of the x86 package temperature thermal driver. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | doc: fix misspellings with 'codespell' toolAnatol Pomozov2013-05-281-1/+1
|/ | | | | Signed-off-by: Anatol Pomozov <anatol.pomozov@gmail.com> Signed-off-by: Jiri Kosina <jkosina@suse.cz>
* Thermal: update documentation for thermal_zone_device_registerZhang Rui2013-04-271-3/+11
| | | | | | Update kernel Documentation for thermal_zone_device_register. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: rename notify_thermal_framework to thermal_notify_frameworkEduardo Valentin2013-04-241-1/+1
| | | | | | | | To follow the prefix names used by the thermal functions, this patch renames notify_thermal_framework to thermal_notify_framework. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: build thermal governors into thermal_sys moduleZhang Rui2013-04-141-8/+0
| | | | | | | | | | | | | | | | | The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
* thermal: add a warning for temperature emulation featureEduardo Valentin2013-04-021-0/+4
| | | | | | | | | | Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: exynos: Adapt to temperature emulation core thermal frameworkAmit Daniel Kachhap2013-04-021-4/+4
| | | | | | | | | | | | | | | | | This removes the driver specific sysfs support of the temperature emulation and uses the newly added core thermal framework for thermal emulation. An exynos platform specific handler is added to support this. In this patch, the exynos senor(tmu) related code and exynos framework related (thermal zone, cooling devices) code are intentionally kept separate. So an emulated function pointer is passed from sensor to framework. This is beneficial in adding more sensor support using the same framework code which is an ongoing work. The goal is to finally split them totally. Even the existing read_temperature also follows the same execution method. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'release' of ↵Linus Torvalds2013-03-013-2/+376
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Highlights: - introduction of Dove thermal sensor driver. - introduction of Kirkwood thermal sensor driver. - introduction of intel_powerclamp thermal cooling device driver. - add interrupt and DT support for rcar thermal driver. - add thermal emulation support which allows platform thermal driver to do software/hardware emulation for thermal issues." * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) thermal: rcar: remove __devinitconst thermal: return an error on failure to register thermal class Thermal: rename thermal governor Kconfig option to avoid generic naming thermal: exynos: Use the new thermal trend type for quick cooling action. Thermal: exynos: Add support for temperature falling interrupt. Thermal: Dove: Add Themal sensor support for Dove. thermal: Add support for the thermal sensor on Kirkwood SoCs thermal: rcar: add Device Tree support thermal: rcar: remove machine_power_off() from rcar_thermal_notify() thermal: rcar: add interrupt support thermal: rcar: add read/write functions for common/priv data thermal: rcar: multi channel support thermal: rcar: use mutex lock instead of spin lock thermal: rcar: enable CPCTL to use hardware TSC deciding thermal: rcar: use parenthesis on macro Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared Thermal: fix a wrong comment thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation PM: intel_powerclamp: off by one in start_power_clamp() thermal: exynos: Miscellaneous fixes to support falling threshold interrupt ...
| * thermal: sysfs: Add a new sysfs node emul_temp for thermal emulationAmit Daniel Kachhap2013-02-061-0/+13
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * PM: Introduce Intel PowerClamp DriverJacob Pan2013-02-061-0/+307
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: Use thermal zone device id in netlink messagesEduardo Valentin2013-01-161-2/+3
| | | | | | | | | | | | | | | | | | | | | | This patch changes the function thermal_generate_netlink_event to receive a thermal zone device instead of a originator id. This way, the messages will always be bound to a thermal zone. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Thermal: exynos: Add sysfs node supporting exynos's emulation mode.Jonghwa Lee2013-01-041-0/+53
| | | | | | | | | | | | | | | | | | | | | | | | This patch supports exynos's emulation mode with newly created sysfs node. Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal management unit. Thermal emulation mode supports software debug for TMU's operation. User can set temperature manually with software code and TMU will read current temperature from user value not from sensor's value. This patch includes also documentary placed under Documentation/thermal/. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | drm/nouveau/hwmon: s/fan0/fan1/Ben Skeggs2013-02-201-1/+1
| | | | | | | | | | | | Fan speed info now shown by sensors. Signed-off-by: Ben Skeggs <bskeggs@redhat.com>
* | drm/nouveau/doc: document the sysfs thermal management interfaceMartin Peres2013-02-201-0/+81
|/ | | | | Signed-off-by: Martin Peres <martin.peres@labri.fr> Signed-off-by: Ben Skeggs <bskeggs@redhat.com>
* Thermal: Add documentation for platform layer dataDurgadoss R2012-11-051-0/+64
| | | | | | | | | This patch adds documentation for thermal_bind_params and thermal_zone_params structures. Also, adds details on EXPORT_SYMBOL APIs. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-241-0/+52
| | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-241-0/+32
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: set upper and lower limitsZhang Rui2012-09-241-1/+8
| | | | | | | | | set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
generated by cgit v1.2.3 (git 2.39.1) at 2024-12-20 23:16:06 +0100