| Commit message (Collapse) | Author | Age | Files | Lines |
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The arm dts directory has grown to 1559 boards which makes it a bit
unwieldy to maintain and use. Past attempts stalled out due to plans to
move .dts files out of the kernel tree. Doing that is no longer planned
(any time soon at least), so let's go ahead and group .dts files by
vendors. This move aligns arm with arm64 .dts file structure.
There's no change to dtbs_install as the flat structure is maintained on
install.
The naming of vendor directories is roughly in this order of preference:
- Matching original and current SoC vendor prefix/name (e.g. ti, qcom)
- Current vendor prefix/name if still actively sold (SoCs which have
been aquired) (e.g. nxp/imx)
- Existing platform name for older platforms not sold/maintained by any
company (e.g. gemini, nspire)
The whole move was scripted with the exception of MAINTAINERS and a few
makefile fixups.
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Michal Simek <michal.simek@amd.com> #Xilinx
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Paul Barker <paul.barker@sancloud.com>
Acked-by: Tony Lindgren <tony@atomide.com>
Acked-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Wei Xu <xuwei5@hisilicon.com> #hisilicon
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Nick Hawkins <nick.hawkins@hpe.com>
Acked-by: Baruch Siach <baruch@tkos.co.il>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Reviewed-by: Andre Przywara <andre.przywara@arm.com>
Acked-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Claudiu Beznea <claudiu.beznea@microchip.com>
Acked-by: Peter Rosin <peda@axentia.se>
Acked-by: Jesper Nilsson <jesper.nilsson@axis.com>
Acked-by: Sudeep Holla <sudeep.holla@arm.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #broadcom
Acked-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Jisheng Zhang <jszhang@kernel.org>
Acked-by: Patrice Chotard <patrice.chotard@foss.st.com>
Acked-by: Romain Perier <romain.perier@gmail.com>
Acked-by: Alexandre TORGUE <alexandre.torgue@st.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Acked-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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TMU node uses 0 as thermal-sensor-cells, thus thermal zone referencing
it must not have an argument to phandle. This was not critical before,
but since rework of thermal Devicetree initialization in the
commit 3fd6d6e2b4e8 ("thermal/of: Rework the thermal device tree
initialization"), this leads to errors registering thermal zones other
than first one:
thermal_sys: cpu0-thermal: Failed to read thermal-sensors cells: -2
thermal_sys: Failed to find thermal zone for tmu id=0
exynos-tmu 10064000.tmu: Failed to register sensor: -2
exynos-tmu: probe of 10064000.tmu failed with error -2
Fixes: 1ac49427b566 ("ARM: dts: exynos: Add support for Hardkernel's Odroid HC1 board")
Cc: <stable@vger.kernel.org>
Link: https://lore.kernel.org/r/20230209105841.779596-5-krzysztof.kozlowski@linaro.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
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Add common LED properties - the function and color - to LED node in
Exynos5422 Odroid HC1, so we can drop deprecated label property.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220620175716.132143-7-krzysztof.kozlowski@linaro.org
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There is no "max_brightness" property as pointed out by dtschema:
arch/arm/boot/dts/exynos5422-odroidhc1.dt.yaml: led-controller: led-1: 'max-brightness' is a required property
Fixes: 1ac49427b566 ("ARM: dts: exynos: Add support for Hardkernel's Odroid HC1 board")
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Link: https://lore.kernel.org/r/20210505135941.59898-4-krzysztof.kozlowski@canonical.com
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The node names for devices using the pwm-leds driver follow a certain
naming scheme (now). Parent node name is not enforced, but recommended
by DT project.
arch/arm/boot/dts/exynos5410-odroidxu.dt.yaml: pwmleds:
'blueled', 'greenled' do not match any of the regexes: '^led(-[0-9a-f]+)?$', 'pinctrl-[0-9]+'
arch/arm/boot/dts/exynos5422-odroidhc1.dt.yaml: pwmleds:
'blueled' does not match any of the regexes: '^led(-[0-9a-f]+)?$', 'pinctrl-[0-9]+'
From schema: Documentation/devicetree/bindings/leds/leds-pwm.yaml
Signed-off-by: Alexander Dahl <post@lespocky.de>
Link: https://lore.kernel.org/r/20201005203451.9985-8-post@lespocky.de
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Add trip points and cooling maps for GPU thermal zone for Odroid
XU3/XU4/HC1 boards. Trip points are based on the CPU thermal zone for the
those boards.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Add missing 2.0GHz, 1.9GHz & 1.8GHz OPPs (for A15 cores) and 1.4GHz
OPP (for A7 cores). Also update common Odroid-XU3 Lite/XU3/XU4
thermal cooling maps to account for new OPPs.
Since some new OPPs are not available on all Exynos5422/5800 boards
modify dts files for Odroid XU3 Lite (limited to 1.8 GHz / 1.3 GHz) &
Peach Pi (limited to 2.0 GHz / 1.3 GHz) accordingly.
This patch uses maximum voltages for new OPPs. This is a temporary
solution till proper Exynos ASV support is added.
Also while at it fix the number of cooling down steps for big cores
(should be 11 instead of 12 on Odroid XU3 Lite and 14 on XU3/XU4).
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[mszyprow: rebased onto v5.5-rc1 and adapted to recent dts changes,
fixed removal of the 1.4GHz OPP for A7s on Peach-Pi]
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Replace GPL v2.0 license statements with SPDX license identifiers.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Odroid HC1 board is based on Odroid XU4 board, but it has no HDMI,
no eMMC, no built-in USB3.0 hub, no extension port pins, and no GPIO
button. USB3.0 ports are used for built-in JMicron USB to SATA bridge
and Gigabit R8152 ethernet chips. HC1 uses only passive cooling.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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