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*-. Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and ↵Zhang Rui2016-09-271-0/+10
|\ \ | | | | | | | | | 'thermal-tegra-hw-throttle' into next
| | * thermal: add Intel BXT WhiskeyCove PMIC thermal driverBin Gao2016-09-061-0/+10
| |/ | | | | | | | | | | | | | | | | | | | | This change adds support for Intel BXT Whiskey Cove PMIC thermal driver which is intended to handle the alert interrupts triggered upon thermal trip point cross and notify the thermal framework appropriately with the zone, temp, crossed trip and event details. Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com> Signed-off-by: Bin Gao <bin.gao@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: max77620: Add thermal driver for reporting junction tempLaxman Dewangan2016-09-271-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | Maxim Semiconductor Max77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add thermal driver to register PMIC die temperature as thermal zone sensor and capture the die temperature warning interrupts to notifying the client. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: imx: depend on imx SoC archPeter Robinson2016-09-271-1/+1
| | | | | | | | | | | | | | | | | | | | | | Not much use unless the SoC is selected so depend on the ARCH_MXC and COMPILE_TEST like all the other thermal drivers. v2: drop extraneous OF Signed-off-by: Peter Robinson <pbrobinson@gmail.com> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: qoriq: Add thermal management supportJia Hongtao2016-09-271-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | This driver add thermal management support by enabling TMU (Thermal Monitoring Unit) on QorIQ platform. It's based on thermal of framework: - Trip points defined in device tree. - Cpufreq as cooling device registered in qoriq cpufreq driver. Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | thermal: qcom: tsens: Add a skeletal TSENS driversRajendra Nayak2016-09-271-0/+5
|/ | | | | | | | | | | | | | | | | | | | TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branch 'next' of ↵Linus Torvalds2016-05-261-10/+21
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: - Introduce generic ADC thermal driver, based on OF thermal (Laxman Dewangan) - Introduce new thermal driver for Tango chips (Marc Gonzalez) - Rockchip driver support for RK3399, RK3366, and some fixes (Caesar Wang, Elaine Zhang and Shawn Lin) - Add CPU power cooling model to Mediatek thermal driver (Dawei Chien) - Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin) - TI thermal driver gained a new maintainer (Keerthy). - Enabled powerclamp driver by checking CPU feature and package cstate counter instead of CPU whitelist (Jacob Pan) - Various fixes on thermal governor, OF thermal, Tegra, and RCAR * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits) thermal: tango: initialize TEMPSI_CFG thermal: rockchip: use the usleep_range instead of udelay thermal: rockchip: add the notes for better reading thermal: rockchip: Support RK3366 SoCs in the thermal driver thermal: rockchip: handle the power sequence for tsadc controller thermal: rockchip: update the tsadc table for rk3399 thermal: rockchip: fixes the code_to_temp for tsadc driver thermal: rockchip: disable thermal->clk in err case thermal: tegra: add Tegra132 specific SOC_THERM driver thermal: fix ptr_ret.cocci warnings thermal: mediatek: Add cpu dynamic power cooling model. thermal: generic-adc: Add ADC based thermal sensor driver thermal: generic-adc: Add DT binding for ADC based thermal sensor thermal: tegra: fix static checker warning thermal: tegra: mark PM functions __maybe_unused thermal: add temperature sensor support for tango SoC thermal: hisilicon: fix IRQ imbalance enabling thermal: hisilicon: support to use any sensor thermal: rcar: Remove binding docs for r8a7794 thermal: tegra: add PM support ...
| * thermal: generic-adc: Add ADC based thermal sensor driverLaxman Dewangan2016-05-171-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In some of platform, thermal sensors like NCT thermistors are connected to the one of ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC. Lookup table for ADC read value to temperature is referred to get temperature. ADC is read via IIO framework. Add support for thermal sensor driver which read the voltage across sensor resistance from ADC through IIO framework. Acked-by: Jonathan Cameron <jic23@kernel.org> Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: add temperature sensor support for tango SoCMarc Gonzalez2016-05-171-0/+9
| | | | | | | | | | | | | | | | | | | | | | The Tango thermal driver provides support for the primitive temperature sensor embedded in Tango chips since the SMP8758. This sensor only generates a 1-bit signal to indicate whether the die temperature exceeds a programmable threshold. Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: tegra: move tegra thermal files into tegra directoryWei Ni2016-05-171-10/+2
| | | | | | | | | | | | | | | | | | | | Move Tegra soctherm driver to tegra directory, it's easy to maintain and add more new function support for Tegra platforms. This will also help to split soctherm driver into common parts and chip specific data related parts. Signed-off-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | Thermal / ACPI / video: add INT3406 thermal driverAaron Lu2016-05-111-25/+3
|/ | | | | | | | | | INT3406 ACPI device object resembles an ACPI video output device, but its _BCM is said to be deprecated and should not be used. So we will make use of the raw interface to do the actual cooling. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
* thermal: fix Mediatek thermal controller buildJohannes Berg2016-04-211-0/+1
| | | | | | | | | | | At least with CONFIG_COMPILE_TEST, there's no reason to assume that CONFIG_RESET_CONTROLLER is set, but the code for this controller requires it since it calls device_reset(). Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER. Signed-off-by: Johannes Berg <johannes.berg@intel.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: fix mtk_thermal build dependencyRandy Dunlap2016-04-211-0/+1
| | | | | | | | | | | | | | | | | | Fix build errors when MTK_THERMAL=y and NVMEM=m by preventing that Kconfig combination. drivers/built-in.o: In function `mtk_thermal_probe': mtk_thermal.c:(.text+0xffa8f): undefined reference to `nvmem_cell_get' mtk_thermal.c:(.text+0xffabe): undefined reference to `nvmem_cell_read' mtk_thermal.c:(.text+0xffac9): undefined reference to `nvmem_cell_put' Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: <linux-pm@vger.kernel.org> Cc: Sascha Hauer <s.hauer@pengutronix.de> Cc: Hanyi Wu <hanyi.wu@mediatek.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'linus' of ↵Zhang Rui2016-03-151-0/+9
|\ | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
| * thermal: mtk: allow compile testing on UMEduardo Valentin2016-03-081-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Following the fix on thermal Kconfig, this patch adds dependency on HAS_IOMEM so driver properly compile test on UM arch. Cc: Krzysztof Kozlowski <k.kozlowski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Matthias Brugger <matthias.bgg@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-mediatek@lists.infradead.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: Add Mediatek thermal controller supportSascha Hauer2016-02-181-0/+8
| | | | | | | | | | | | | | | | | | | | | | | | This adds support for the Mediatek thermal controller found on MT8173 and likely other SoCs. The controller is a bit special. It does not have its own ADC, instead it controls the on-SoC AUXADC via AHB bus accesses. For this reason we need the physical address of the AUXADC. Also it controls a mux using AHB bus accesses, so we need the APMIXEDSYS physical address aswell. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: Fix build error of missing devm_ioremap_resource on UMKrzysztof Kozlowski2016-03-081-0/+8
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The devres.o gets linked if HAS_IOMEM is present so on ARCH=um allyesconfig (COMPILE_TEST) failed on many files with: drivers/built-in.o: In function `kirkwood_thermal_probe': kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource' drivers/built-in.o: In function `exynos_tmu_probe': exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap' The users of devm_ioremap_resource() which are compile-testable should depend on HAS_IOMEM. Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: rcar: Use ARCH_RENESASSimon Horman2016-03-081-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | Make use of ARCH_RENESAS in place of ARCH_SHMOBILE. This is part of an ongoing process to migrate from ARCH_SHMOBILE to ARCH_RENESAS the motivation for which being that RENESAS seems to be a more appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs. Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Simon Horman <horms+renesas@verge.net.au> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: db8500_cpufreq_cooling: Compile with COMPILE_TESTLuis de Bethencourt2016-03-081-1/+1
|/ | | | | | | | | | | This driver only has runtime but no build time dependencies, so it can be built for testing purposes if the Kconfig COMPILE_TEST option is enabled. This is useful to have more build coverage and make sure that drivers are not affected by changes that could cause build regressions. Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: allow u8500-thermal driver to be a moduleArnd Bergmann2016-02-091-2/+2
| | | | | | | | | | | | | | | | When the thermal subsystem is a loadable module, the u8500 driver fails to build: drivers/thermal/built-in.o: In function `db8500_thermal_probe': db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register' drivers/thermal/built-in.o: In function `db8500_thermal_work': db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: allow spear-thermal driver to be a moduleArnd Bergmann2016-02-091-1/+1
| | | | | | | | | | | | | | | | When the thermal subsystem is a loadable module, the spear driver fails to build: drivers/thermal/built-in.o: In function `spear_thermal_exit': spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister' drivers/thermal/built-in.o: In function `spear_thermal_probe': spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register' This changes the symbol to a tristate, so Kconfig can track the dependency correctly. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Revert "thermal: qcom_spmi: allow compile test"Arnd Bergmann2015-11-241-1/+1
| | | | | | | | | | | | | | | | | | | | | | This just caused build errors: warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI) drivers/built-in.o: In function `regmap_spmi_ext_gather_write': :(.text+0x609b0): undefined reference to `spmi_ext_register_write' :(.text+0x609f0): undefined reference to `spmi_ext_register_writel' While it's generally a good idea to allow compile testing, in this case, it just doesn't work, so reverting the patch that introduced the compile-test variant seems the most appropriate solution. Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST' statement, so we should be able to enable SPMI on all architectures for compile testing already. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Fixes: cb7fb4d34202 ("thermal: qcom_spmi: allow compile test") Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
*-. Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into nextZhang Rui2015-11-061-0/+17
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| | * thermal: Add devfreq coolingØrjan Eide2015-10-301-0/+14
| |/ |/| | | | | | | | | | | | | | | | | | | | | | | | | Add a generic thermal cooling device for devfreq, that is similar to cpu_cooling. The device must use devfreq. In order to use the power extension of the cooling device, it must have registered its OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Ørjan Eide <orjan.eide@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermalSrinivas Pandruvada2015-10-101-0/+3
|/ | | | | | | | | | | | After the commit "thermal: core: Add Kconfig option to enable writable trips", by default the trips are read only. This cause user space thermal controllers to poll for temperature as they can't set temperature thresholds for getting a notification via uevents. These programs use RW trip in a zone to register thresholds. Since we need to enable the new config introduced by above commit to allow writable trips, selecting CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* thermal: ti-soc: Kconfig fix to avoid menu showing wronglyEduardo Valentin2015-09-141-0/+1
| | | | | | | | | | Move the dependencies to menu, so we avoid showing it wrongly. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: qcom_spmi: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | Adding COMPILE_TEST flag to qcom_spmi driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: exynos: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | | | Adding COMPILE_TEST flag to exynos driver to facilitate maintenance. Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: armada: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | Adding COMPILE_TEST flag to armada driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: dove: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | Adding COMPILE_TEST flag to dove driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: kirkwood: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | Adding COMPILE_TEST flag to kirkwood driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: rockchip: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | | | | Adding COMPILE_TEST flag to rockchip driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Heiko Stuebner <heiko@sntech.de> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-rockchip@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: spear: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | | | Adding COMPILE_TEST flag to spear driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: hisi: allow compile testEduardo Valentin2015-09-141-1/+1
| | | | | | | | | Adding COMPILE_TEST flag to hisi driver to facilitate maintenance. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Intel PCH thermal driverTushar Dave2015-08-041-0/+8
| | | | | | | | | | This change adds a thermal driver for Wildcat Point platform controller hub. This driver register PCH thermal sensor as a thermal zone and associate critical and hot trips if present. Signed-off-by: Tushar Dave <tushar.n.dave@intel.com> Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Merge branches 'release' and 'thermal-soc' of .git into nextZhang Rui2015-06-111-0/+44
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| * thermal: hisilicon: add new hisilicon thermal sensor driverkongxinwei2015-06-041-0/+8
| | | | | | | | | | | | | | | | | | | | This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: Leo Yan <leo.yan@linaro.org> Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: remove stale THERMAL_POWER_ACTOR selectJavi Merino2015-05-051-1/+0
| | | | | | | | | | | | | | | | | | | | | | A previous version of this patch had a config for THERMAL_POWER_ACTOR but it was dropped. Remove the select as it is not doing anything. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reported-by: Valentin Rothberg <valentinrothberg@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: core: Add Kconfig option to enable writable tripsPunit Agrawal2015-05-051-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: introduce the Power Allocator governorJavi Merino2015-05-051-0/+15
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * thermal: Add QPNP PMIC temperature alarm driverIvan T. Ivanov2015-05-051-0/+11
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* | thermal: intel Quark SoC X1000 DTS thermal driverOng, Boon Leong2015-05-011-0/+10
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS). The DTS offers both hot & critical trip points. However, in current distribution of UEFI BIOS for Quark platform, only critical trip point is configured to be 105 degree Celsius (based on Quark SW ver1.0.1 and hot trip point is not used due to lack of IRQ. There is no active cooling device for Quark SoC, so Quark SoC thermal management logic expects Linux distro to orderly power-off when temperature of the DTS exceeds the configured critical trip point. Kernel param "polling_delay" in milliseconds is used to control the frequency the DTS temperature is read by thermal framework. It defaults to 2-second. To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X". User interacts with Quark SoC DTS thermal driver through sysfs via: /sys/class/thermal/thermal_zone0/ For example: - to read DTS temperature $ cat temp - to read critical trip point $ cat trip_point_0_temp - to read trip point type $ cat trip_point_0_type - to emulate temperature raise to test orderly shutdown by Linux distro $ echo 105 > emul_temp Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com> Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie> Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* | Thermal/int340x/processor_thermal: Enable auxiliary DTS for BraswellSrinivas Pandruvada2015-05-011-0/+1
| | | | | | | | | | | | | | | | Support two auxiliary DTS present on Braswell platform using side band IOSF interface. This supports two read write trips, which can be used to get notification on trip violation. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* | Thermal: Intel SoC: DTS thermal use common APIsSrinivas Pandruvada2015-05-011-1/+2
| | | | | | | | | | | | | | | | | | | | There is no change in functionality but using the common IOSF core APIs. This driver is now just responsible for enumeration and call relevant API to create thermal zone and register critical trip. Also cpuid 0x4c is now handled in the int340x processor thermal driver with the same functionality. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* | Thermal: Intel SoC: DTS thermal IOSF coreSrinivas Pandruvada2015-05-011-0/+10
|/ | | | | | | | | | | This is becoming a common feature for Intel SoCs to expose the additional digital temperature sensors (DTSs) using side band interface (IOSF). This change remove common IOSF DTS handler function from the existing driver intel_soc_dts_thermal.c and creates a stand alone module, which can be selected from the SoC specific drivers. In this way there is less code duplication. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
* thermal: rockchip: add driver for thermalCaesar Wang2014-11-241-0/+10
| | | | | | | | | | | | | | | | | | | | Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: Add Tegra SOCTHERM thermal management driverMikko Perttunen2014-11-201-0/+10
| | | | | | | | | This adds support for the Tegra SOCTHERM thermal sensing and management system found in the Tegra124 system-on-chip. This initial driver supports temperature polling for four thermal zones. Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: introduce clock cooling deviceEduardo Valentin2014-11-201-0/+12
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* Merge branch 'next' of ↵Linus Torvalds2014-10-241-15/+34
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Sorry that I missed the merge window as there is a bug found in the last minute, and I have to fix it and wait for the code to be tested in linux-next tree for a few days. Now the buggy patch has been dropped entirely from my next branch. Thus I hope those changes can still be merged in 3.18-rc2 as most of them are platform thermal driver changes. Specifics: - introduce ACPI INT340X thermal drivers. Newer laptops and tablets may have thermal sensors and other devices with thermal control capabilities that are exposed for the OS to use via the ACPI INT340x device objects. Several drivers are introduced to expose the temperature information and cooling ability from these objects to user-space via the normal thermal framework. From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui. - introduce a new thermal governor, which just uses a hysteresis to switch abruptly on/off a cooling device. This governor can be used to control certain fan devices that can not be throttled but just switched on or off. From: Peter Feuerer. - introduce support for some new thermal interrupt functions on i.MX6SX, in IMX thermal driver. From: Anson, Huang. - introduce tracing support on thermal framework. From: Punit Agrawal. - small fixes in OF thermal and thermal step_wise governor" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits) Thermal: int340x thermal: select ACPI fan driver Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs Thermal: int340x_thermal: expose acpi thermal relationship tables Thermal: introduce int3403 thermal driver Thermal: introduce INT3402 thermal driver Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h ACPI / Fan: support INT3404 thermal device ACPI / Fan: add ACPI 4.0 style fan support ACPI / fan: convert to platform driver ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant ACPI / fan: remove no need check for device pointer ACPI / fan: remove unused macro Thermal: int3400 thermal: register to thermal framework Thermal: int3400 thermal: add capability to detect supporting UUIDs Thermal: introduce int3400 thermal driver ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package() ACPI: make acpi_create_platform_device() an external API thermal: step_wise: fix: Prevent from binary overflow when trend is dropping ACPI: introduce ACPI int340x thermal scan handler thermal: Added Bang-bang thermal governor ...
| * Merge branch 'int340x-thermal' of .git into nextZhang Rui2014-10-171-15/+24
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