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Fix up the following warning when compiled with make W=1:
linux.git/drivers/thermal/max77620_thermal.c:48: warning: Function
parameter or member 'temp' not described in 'max77620_thermal_read_temp'
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/c943d51e7913a4b73cda447547b8ee77c857f7ba.1574242756.git.amit.kucheria@linaro.org
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Based on 1 normalized pattern(s):
this program is free software you can redistribute it and or modify
it under the terms and conditions of the gnu general public license
version 2 as published by the free software foundation
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 101 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190531190113.822954939@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.
This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.
Fixes: ec4664b3fd6d ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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The thermal child device reuses the parent MFD-device device-tree node
when registering a thermal zone, but did not take a reference to the
node.
This leads to a reference imbalance, and potential use-after-free, when
the node reference is dropped by the platform-bus device destructor
(once for the child and later again for the parent).
Fix this by dropping any reference already held to a device-tree node
and getting a reference to the parent's node which will be balanced on
reprobe or on platform-device release, whichever comes first.
Note that simply clearing the of_node pointer on probe errors and on
driver unbind would not allow the use of device-managed resources as
specifically thermal_zone_of_sensor_unregister() claims that a valid
device-tree node pointer is needed during deregistration (even if it
currently does not seem to use it).
Fixes: ec4664b3fd6d ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: stable <stable@vger.kernel.org> # 4.9
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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If the driver is built as a module, autoload won't work because the module
alias information is not filled. So user-space can't match the registered
device with the corresponding module.
Export the module alias information using the MODULE_DEVICE_TABLE() macro.
Before this patch:
$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
$
After this patch:
$ modinfo drivers/thermal/max77620_thermal.ko | grep alias
alias: platform:max77620-thermal
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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