linux - linux

	Commit message (Collapse)	Author	Age	Files	Lines
*	thermal: ti-soc-thermal: remove dead code	Bartlomiej Zolnierkiewicz	2018-07-27	1	-68/+0
\| \| \| \| \| \| \| \| \| \| \| \| \| \|	Majority of this code (i.e. functions from ti-bandgap.c) has been introduced in May 2013 by commit eb982001dbd8 ("thermal: introduce TI SoC thermal driver"). Just remove it altogether (in case it is needed it can be easily resurrected from git repo). While at it fix incorrect "not used" comments. Tested-by: Keerthy <j-keerthy@ti.com> Acked-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
*	thermal: arm: dra752: Remove all TSHUT related definitions	Keerthy	2017-02-19	1	-19/+0
\| \| \| \| \| \| \| \|	No configuration needs to be done for TSHUT from software. Hence remove all the unnecessary definitions. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
*	thermal: ti-soc-thermal: add thermal data for DRA752 chips	Eduardo Valentin	2013-06-13	1	-0/+280
	This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>