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* thermal/drivers/ti: Remove unused macros ti_thermal_get_trip_value() / ↵Daniel Lezcano2023-01-061-15/+0
| | | | | | | | | | | | | | ti_thermal_trip_is_valid() The macros: ti_thermal_get_trip_value() ti_thermal_trip_is_valid() are unused. Remove them. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20221003092602.1323944-26-daniel.lezcano@linaro.org
* treewide: Replace GPLv2 boilerplate/reference with SPDX - rule 336Thomas Gleixner2019-06-051-15/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | Based on 1 normalized pattern(s): this program is free software you can redistribute it and or modify it under the terms of the gnu general public license version 2 as published by the free software foundation this program is distributed in the hope that it will be useful but without any warranty without even the implied warranty of merchantability or fitness for a particular purpose see the gnu general public license for more details you should have received a copy of the gnu general public license along with this program if not write to the free software foundation inc 51 franklin st fifth floor boston ma 02110 1301 usa extracted by the scancode license scanner the SPDX license identifier GPL-2.0-only has been chosen to replace the boilerplate/reference in 246 file(s). Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Alexios Zavras <alexios.zavras@intel.com> Reviewed-by: Allison Randal <allison@lohutok.net> Cc: linux-spdx@vger.kernel.org Link: https://lkml.kernel.org/r/20190530000436.674189849@linutronix.de Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
* thermal: ti-soc-thermal: Remove redundant constantsKeerthy2017-03-301-16/+0
| | | | | | | | Now that slope and offset data are being passed from device tree no need to populate in driver data. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* thermal: ti-soc-thermal: add thermal data for DRA752 chipsEduardo Valentin2013-06-131-0/+6
| | | | | | | | | | | | | | | | | | | | | This patch adds the thermal data for TI DRA752 chips. In this change it includes (autogen): . Register offset definitions . Bitfields and masks for all registers . Conversion table Also, the thermal limits, thresholds and extrapolation rules are included. The extrapolation rule is simply add +2C as margin. All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined and exposed. Only MPU has cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: introduce TI SoC thermal driverEduardo Valentin2013-05-281-0/+117
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>