| Commit message (Collapse) | Author | Age | Files | Lines |
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
"The top merge commit was re-generated yesterday because two topic
branches were dropped from this pull request in the last minute due to
some unaddressed comments. All the other material has been in
linux-next for quite a while.
Specifics:
- Enhance thermal core to handle unexpected device cooling states
after fresh boot and system resume. From Zhang Rui and Chen Yu.
- Several fixes and cleanups on Rockchip and RCAR thermal drivers.
From Caesar Wang and Kuninori Morimoto.
- Add Broxton support for Intel processor thermal reporting device
driver. From Amy Wiles"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
thermal: trip_point_temp_store() calls thermal_zone_device_update()
thermal: rcar: rcar_thermal_get_temp() return error if strange temp
thermal: rcar: check irq possibility in rcar_thermal_irq_xxx()
thermal: rcar: check every rcar_thermal_update_temp() return value
thermal: rcar: move rcar_thermal_dt_ids to upside
thermal: rockchip: Support the RK3399 SoCs in thermal driver
thermal: rockchip: Support the RK3228 SoCs in thermal driver
dt-bindings: rockchip-thermal: Support the RK3228/RK3399 SoCs compatible
thermal: rockchip: fix a trivial typo
Thermal: Enable Broxton SoC thermal reporting device
thermal: constify pch_dev_ops structure
Thermal: do thermal zone update after a cooling device registered
Thermal: handle thermal zone device properly during system sleep
Thermal: initialize thermal zone device correctly
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trip_point_temp_store() updates trip temperature. It should call
thermal_zone_device_update() immediately.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Current rcar thermal driver sometimes checks irq possibility when it
calls rcar_thermal_irq_enable/disable(), but sometimes not.
This patch checks it inside rcar_thermal_irq_enable/disable().
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Every rcar_thermal_update_temp() return value will be checked.
And also, rcar_thermal_get_temp() always call
rcar_thermal_update_temp() by this patch.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch is prepare for of-thermal support.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The RK3399 SoCs have two Temperature Sensors, channel 0 is for CPU.
channel 1 is for GPU.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The RK3228 SoCs has one Temperature Sensor, channel 0 is for CPU.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patchset trys to dictate unified format for driver.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.
This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.
Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/
CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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Current thermal code does not handle system sleep well because
1. the cooling device cooling state may be changed during suspend
2. the previous temperature reading becomes invalid after resumed because
it is got before system sleep
3. updating thermal zone device during suspending/resuming
is wrong because some devices may have already been suspended
or may have not been resumed.
Thus, the proper way to do this is to cancel all thermal zone
device update requirements during suspend/resume, and after all
the devices have been resumed, reset and update every registered
thermal zone devices.
This also fixes a regression introduced by:
Commit 19593a1fb1f6 ("ACPI / fan: convert to platform driver")
Because, with above commit applied, all the fan devices are attached
to the acpi_general_pm_domain, and they are turned on by the pm_domain
automatically after resume, without the awareness of thermal core.
CC: <stable@vger.kernel.org> #3.18+
Reference: https://bugzilla.kernel.org/show_bug.cgi?id=78201
Reference: https://bugzilla.kernel.org/show_bug.cgi?id=91411
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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Signed-off-by: Amy Wiles <amy.l.wiles@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The pch_dev_ops structure is never modified. It is only stored in a field
that is already declared as const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The read and write opcodes are global for all units on SoC and even across
Intel SoCs. Remove duplication of corresponding constants. At the same time
convert all current users.
No functional change.
Acked-by: Thomas Gleixner <tglx@linutronix.de>
Acked-by: Boon Leong Ong <boon.leong.ong@intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The IMX6Q/IMX6DL SoC's have a 2-bit temperature grade stored in OTP which
is valid for all IMX6 SoC's (despite the fact that the IMXSDLRM and
IMXSXRM do not document this - this has been proven via tests as well as
verified by Freescale FAE).
Instead of assuming a fixed 85C for passive cooling threshold and 105C for
critical use the thermal grade for these configurations.
We will set the critical to maxT - 5C and passive to maxT - 10C.
Cc: Anson Huang <b20788@freescale.com>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Jon Nettleton <jon@solid-run.com>
Signed-off-by: Tim Harvey <tharvey@gateworks.com>
----
v3:
- rebase against linux-soc-thermal.git
- added ack's from Shawn and Jon
v2:
- remove check for IMX6Q and update comments: The OTP values have been tested
on IMX6SOLO, IMX6DUALLITE, and IMX6SX and Freescale FAE has shared data with
me that the OTP settings are the same and that the reference manuals will
reflect this in their next updates.
- set critical to max - 5C
- set passive to max - 10C
- display max temp in info
- do not allow passive to be set above critical
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This just caused build errors:
warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'
While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.
Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d34202 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Probe error operation and remove operation are same.
Let's use same function.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Some systems register thermal zone by themself and don't need to
have thermal zones node in DT. Therefore reduce the log level from
ERROR to DEBUG when thermal zone node can't be find in
of_thermal_destroy_zones().
Signed-off-by: Jiada Wang <jiada_wang@mentor.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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All thermal governors use the temperature value stored in
struct thermal_zone_device.
thermal_zone_device->temperature
power_allocator governor should not deviate from this and use
the same.
Cc: Javi Merino <javi.merino@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Daniel Kurtz <djkurtz@chromium.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Cc: Sascha Hauer <s.hauer@pengutronix.de>
Cc: Andrea Arcangeli <aarcange@redhat.com>
Acked-by: Javi Merino <javi.merino@arm.com>
Reported-by: Sugumar Natarajan <sugumar.natarajan@arm.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The RK3368 SoCs support to 2 channel TS-ADC, the temperature criteria
of each channel can be configurable.
The system has two Temperature Sensors, channel 0 is for CPU,
and channel 1 is for GPU.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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As Temperature is currently represented as int not long in the thermal
framework since use int intead of unsigned long/long to represent
temperature to avoid bogus overheat detection when negative temperature
reported.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The conversion table has the adc value and temperature.
In fact, the adc value only has the increment or decrement mode in
conversion table.
Moment, we can add the sort mode to be better support the *code_to_temp*
for differenr SoCs.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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We should make the conversion table in as a parameter since the different
SoCs have the different conversionion table.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The current driver is default to register the two thermal sensors
in probe since some SoCs maybe only have one sensor for thermal.
In some cases, the channel 0 is not always the cpu or gpu sensor.
So add the channel can be configured for sensors.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Missing a include file caused compile error.
drivers/thermal/rockchip_thermal.c: In function 'rockchip_thermal_suspend':
drivers/thermal/rockchip_thermal.c:720:2: error: implicit declaration of function 'pinctrl_pm_select_sleep_state' [-Werror=implicit-function-declaration]
...
Fixes: 7e38a5b1daa1 ("thermal: rockchip: support the sleep pinctrl state
to avoid glitches")
Reported-by: Stephen Rothwell <sfr@canb.auug.org.au>
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal updates from Zhang Rui:
- Implement generic devfreq cooling mechanism through frequency
reduction for devices using devfreq. From Ørjan Eide and Javi
Merino.
- Introduce OMAP3 support on TI SoC thermal driver. From Pavel Mack
and Eduardo Valentin.
- A bounch of small fixes on devfreq_cooling, Exynos, IMX, Armada, and
Rockchip thermal drivers.
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (24 commits)
thermal: exynos: Directly return 0 instead of using local ret variable
thermal: exynos: Remove unneeded semicolon
thermal: exynos: Use IS_ERR() because regulator cannot be NULL
thermal: exynos: Fix first temperature read after registering sensor
thermal: exynos: Fix unbalanced regulator disable on probe failure
devfreq_cooling: return on allocation failure
thermal: rockchip: support the sleep pinctrl state to avoid glitches in s2r
dt-bindings: rockchip-thermal: Add the pinctrl states in this document
thermal: devfreq_cooling: Make power a u64
thermal: devfreq_cooling: use a thermal_cooling_device for register and unregister
thermal: underflow bug in imx_set_trip_temp()
thermal: armada: Fix possible overflow in the Armada 380 thermal sensor formula
thermal: imx: register irq handler later in probe
thermal: rockhip: fix setting thermal shutdown polarity
thermal: rockchip: fix handling of invalid readings
devfreq_cooling: add trace information
thermal: Add devfreq cooling
PM / OPP: get the voltage for all OPPs
tools/thermal: tmon: use pkg-config also for CFLAGS
linux/thermal.h: rename KELVIN_TO_CELSIUS to DECI_KELVIN_TO_CELSIUS
...
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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The 'ret' variable in exynos5440_tmu_initialize() is initialized to 0
and returned as is. Replace it with direct return statement. This also
fixes coccinelle warning:
drivers/thermal/samsung/exynos_tmu.c:611:5-8: Unneeded variable: "ret". Return "0" on line 654
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Remove semicolons after switch statement.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The NULL check in probe's error path is not needed because in that time
the regulator cannot be NULL (regulator_get() returns valid pointer or
ERR_PTR).
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Thermal core could not read the temperature after registering the
thermal sensor with thermal_zone_of_sensor_register() because the driver
was not yet initialized.
The call trace looked like:
exynos_tmu_probe()
thermal_zone_of_sensor_register()
of_thermal_set_mode()
thermal_zone_device_update()
exynos_get_temp()
if (!data->tmu_read) return -EINVAL;
exynos_map_dt_data()
data->tmu_read = ...
This produced an error in dmesg:
thermal thermal_zone0: failed to read out thermal zone (-22)
Register the thermal_zone_device later, after parsing Device Tree and
enabling necessary clocks, but before calling exynos_tmu_initialize()
which uses the registered thermal_zone_device.
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Tested-by: Alim Akhtar <alim.akhtar@samsung.com>
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Fixes: 3b6a1a805f34 ("thermal: samsung: core: Exynos TMU rework to use device tree for configuration")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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During probe if the regulator could not be enabled, the error exit path
would still disable it. This could lead to unbalanced counter of
regulator enable/disable.
The patch moves code for getting and enabling the regulator from
exynos_map_dt_data() to probe function because it is really not a part
of getting Device Tree properties.
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Tested-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Fixes: 5f09a5cbd14a ("thermal: exynos: Disable the regulator on probe failure")
Cc: <stable@vger.kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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If the allocation fails then we can't continue.
Fixes: a76caf55e5b3 ('thermal: Add devfreq cooling')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When we come out of system suspend state (S3) the tsadc will have been
reset and back at its default state. While reprogramming the tsadc
it's possible that we'll glitch the output and unintentionally cause
the "over temperature" GPIO to be asserted. Since the over
temperature GPIO is often hooked up to something that will cause a
reboot or shutdown in hardware, this glitch can be catastrophic on
some boards.
We'll add support for selecting the "sleep" pinctrl state at suspend
time. Boards can use this to effectively disable the tsadc at suspend
time and avoid glitches when the system is resumed.
Reviewed-by: Douglas Anderson <dianders@chromium.org>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The prototype of do_div() is:
uint32_t do_div(uint64_t *n, uint32_t base);
Make power u64 to avoid the following warning:
drivers/thermal/devfreq_cooling.c: In function 'get_dynamic_power':
drivers/thermal/devfreq_cooling.c:267:2: warning: comparison of distinct pointer types lacks a cast [enabled by default]
drivers/thermal/devfreq_cooling.c:267:2: warning: right shift count >= width of type [enabled by default]
drivers/thermal/devfreq_cooling.c:267:2: warning: passing argument 1 of '__div64_32' from incompatible pointer type [enabled by default]
include/asm-generic/div64.h:35:17: note: expected 'uint64_t *' but argument is of type 'long unsigned int *'
Reported-by: kbuild test robot <fengguang.wu@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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unregister
Be consistent with what other cooling devices do and return a struct
thermal_cooling_device * on register. Also, for the unregister, accept
a struct thermal_cooling_device * as parameter.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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We recently changed this from unsigned long to int so it introduced an
underflow bug.
Fixes: 17e8351a7739 ('thermal: consistently use int for temperatures')
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Update the coefficients so the calculation will not overrun the
unsigned long 32bits boundary
Signed-off-by: Nadav Haklai <nadavh@marvell.com>
Reviewed-by: Victor Axelrod <victora@marvell.com>
Reviewed-by: Neta Zur Hershkovits <neta@marvell.com>
Signed-off-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The irq handler should be registered after the tempmon
module has been initialized in a known state and the
thermal_zone and cpu_cooling device have been registered
successfully. Otherwise, if the irq is triggled earlier
before thermal probe has been finished, it may lead to
'NULL' pointer kernel panic.
Signed-off-by: Bai Ping <b51503@freescale.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When requested thermal shutdown signal polarity is low we need to make
sure that the bit representing high level of signal is reset, and not
set all other bits in that register.
Also rename TSADCV2_INT_PD_CLEAR to TSADCV2_INT_PD_CLEAR_MASK to better
reflect its nature.
Acked-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Dmitry Torokhov <dtor@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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We attempted to signal invalid code by returning -EAGAIN from
rk_tsadcv2_code_to_temp(), unfortunately the return value was stuffed
directly into the temperature pointer, potentially confusing upper
layers with temperature of -EINVAL.
Let's split temperature from error/success indicator to avoid such
confusion.
Also change the way we scan the temperature table to start with the 2nd
element so that we do not need to worry that we may reference out of
bounds element while doing binary search and keep checking that we end
up with 'mid' equal to 0 (since we are looking for the temperature that
would fall into interval between the 'mid' and 'mid - 1') .
Tested-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Dmitry Torokhov <dtor@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Tracing is useful for debugging and performance tuning. Add similar
traces to what's present in the cpu cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.
The device must use devfreq. In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdf
Signed-off-by: Eduardo Valentin <edubezva@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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