linux - linux

	Commit message (Collapse)	Author	Age	Files	Lines
*	Merge remote-tracking branch 'asoc/topic/io' into asoc-next	Mark Brown	2014-03-13	1	-10/+0
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\| *	ASoC: codec: Simplify ASoC probe code.	Xiubo Li	2014-03-11	1	-10/+0
\| \| \| \| \| \| \| \| \| \| \| \| \| \| \| \|	For some CODEC drivers like who act as the MFDs children are ignored by this patch. Signed-off-by: Xiubo Li <Li.Xiubo@freescale.com> Signed-off-by: Mark Brown <broonie@linaro.org>
* \|	ASoC: ml26124: Use SOC_ENUM_SINGLE_DECL()	Takashi Iwai	2014-02-23	1	-6/+6
\|/ \| \| \| \| \| \| \| \|	Just replace with the helper macro. No functional change at all. Signed-off-by: Takashi Iwai <tiwai@suse.de> Acked-by: Liam Girdwood <liam.r.girdwood@linux.intel.com> Acked-by: Lars-Peter Clausen <lars@metafoo.de> Signed-off-by: Mark Brown <broonie@linaro.org>
*	ASoC: ml26124: Fix negative array index read	Takashi Iwai	2013-10-30	1	-0/+2
\| \| \| \| \| \| \| \| \|	get_coeff() may return an error. Spotted by coverity CID 703394. Signed-off-by: Takashi Iwai <tiwai@suse.de> Signed-off-by: Mark Brown <broonie@linaro.org>
*	ASoC: codecs: remove __dev* attributes	Bill Pemberton	2012-12-09	1	-4/+4
\| \| \| \| \| \| \| \| \| \| \|	CONFIG_HOTPLUG is going away as an option. As result the __dev* markings will be going away. Remove use of __devinit, __devexit_p, __devinitdata, __devinitconst, and __devexit. Signed-off-by: Bill Pemberton <wfp5p@virginia.edu> Signed-off-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
*	ASoC: ml26124: Convert to devm_regmap_init_i2c	Axel Lin	2012-06-13	1	-4/+1
\| \| \| \| \| \| \|	This fixes a leak if snd_soc_register_codec fails. Signed-off-by: Axel Lin <axel.lin@gmail.com> Signed-off-by: Mark Brown <broonie@opensource.wolfsonmicro.com>
*	ASoC: Add LAPIS Semiconductor ML26124 driver	Tomoya MORINAGA	2012-04-01	1	-0/+681
	ML26124-01HB/ML26124-02GD is 16bit monaural audio CODEC which has high resistance to voltage noise. On chip regulator realizes power supply rejection ratio be over 90dB so more than 50dB is improved than ever. ML26124-01HB/ ML26124-02GD can deliver stable audio performance without being affected by noise from the power supply circuit and peripheral components. The chip also includes a composite video signal output, which can be applied to various portable device requirements. The ML26124 is realized these functions into very small package the size is only 2.56mm x 2.46mm therefore can be construct high quality sound system easily. ML26124-01HB is 25pin WCSP package; ML26124-02GD is 32pin WQFN package. Signed-off-by: Tomoya MORINAGA <tomoya.rohm@gmail.com> Signed-off-by: Mark Brown <broonie@opensource.wolfsonmicro.com>